We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor!
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.
100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).
The Applied Global Services organization develops products, services and automation software designed to improve the performance and productivity, and reduce the environmental impact, of the fab operations of semiconductor, LCD and solar PV manufacturers. The in-depth expertise and best known methods of Applied Materials' extensive global support infrastructure enable Applied Materials to continuously support customers' production requirements. Applied Materials automation software coordinates and streamlines every aspect of a factory—the processes, equipment and people—to provide competitive advantage to our customers.
Yield Engineering Systems, Inc.
YES supplies innovative, reliable and environment-friendly products and services that transform materials and interfaces for "More than Moore" markets including Advanced Packaging, Life Sciences, AR/VR and MEMS. YES's lab-to-fab "clean, coat, and cure" solutions combine advanced technology, high yield and low cost of ownership to empower technological breakthroughs. Customers ranging from cutting-edge research labs to the world's largest, most demanding high-volume manufacturers trust YES's proven track record (over 3000 systems installed worldwide) and its years of technology leadership in plasma cleaning, monolayer coating and polymer curing. When the future asks for surface modification, YES is the answer!
Lunch Day 1 Sponsor
Akrometrix is the worldwide leader of PCB and component thermal warpage metrology systems and test services for the electronics industry. We measure at-room-temperature warpage,thermal warpage, and thermal strain of substrates, materials, and electronic components and assemblies at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical, and tabular results to prove compliance to industry standards.
Lunch Day 2 Sponsor
Canon USA released a Microfocus X-ray Source with Transmissive Target and Sealed X-ray Tube capable of capturing X-ray images with high resolution and high contrast simultaneously. Canon USA also offers a variety of panel based lithography and deposition solutions that can be extended to a range of applications in markets.
Luggage Tag Sponsor
Micross Components is a global provider of specialty electronic components that have smaller form factors with higher reliability than commercially available components. Micross’ solutions range from bare die and wafer processing through advanced and custom packaging, component modification services and and leading edge component design and test. Micross possesses the design, manufacturing, testing and logistics expertise needed to support an application from conception to fully tested and packaged component.
Notepad and Pen Sponsor
SVXR manufactures High resolution – Automated X-ray Inspection (HR-AXI). HR-AXI is a new category of inline transmissive inspection and metrology equipment designed to bring front of line semiconductor fab-like inspection to advanced packaging manufacturers. Our unique and proprietary data collection architecture rapidly collects large field of view transmissive data at full resolution with 16 bit high bandwidth sensitivity. These data are analyzed in real time to detect small deviations in the structure of user defined regions of interest.
Simco-Ion, the world's largest supplier of static control and monitoring solutions offers a comprehensive portfolio of ISO-designed ionizers and digital controllers to address electrostatic charge/discharge problems in clean manufacturing environments. We offer product solutions to address Industry 4.0 requirements and new manufacturing processes. Our Novx products provide real-time monitoring, analyze, and control ionization while providing production traceability and control. Innovative products, specially designed to operate in extreme temperatures and critical environments, meet or exceed ISO cleanroom standards. Exclusive in the industry! We offer custom evaluations; a full diagnostics service by our experienced engineers and renowned applications specialist to develop a total solutions package to manage your electrostatic challenges, improve operations, increase product yield and control cost.
Tote Bag Sponsor
LB Semicon was the first company in Korea to start business in the flip-chip wafer bumping field with all necessary production facilities established. Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon has expanded its scope into Solder bumping, Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology. With its cutting-edge technology and spirit of enterprise, LB Semicon promises to serve as a company that provides products and services of the highest quality so that we can move forward alongside our customers.