Advanced Packaging in the New Connected World
October 22 - 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

Panel Discussion

Tuesday, October 22

Tanja Braun Jan Vardaman

Large Organic Panels: How Can We Achieve 2µm L/S?

Tanja Braun, Ph.D., Fraunhofer IZM
E. Jan Vardaman, TechSearch International, Inc.

The need for increased interconnect density to support high-performance application including high-bandwidth memory (HBM) and logic is driving the development of new substrate options with 2µm lines and spaces (L/S). Challenges include material selection, design, and fabrication of features, inspection, test, and reliability will be discussed. The panel members will discuss views on mitigating these and other challenges in the race to achieve cost-effective solutions.

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Organized by: SMTA and ChipScale Review

Supported by:
IEEE Electronic Packaging Society

Supporting Media:
MEPTEC Open Sky Communications