Tuesday, October 22
Large Organic Panels: How Can We Achieve 2µm L/S?
Tanja Braun, Ph.D., Fraunhofer IZM
E. Jan Vardaman, TechSearch International, Inc.
The need for increased interconnect density to support high-performance application including high-bandwidth memory (HBM) and logic is driving the development of new substrate options with 2µm lines and spaces (L/S). Challenges include material selection, design, and fabrication of features, inspection, test, and reliability will be discussed. The panel members will discuss views on mitigating these and other challenges in the race to achieve cost-effective solutions.