Advanced Packaging in the New Connected World
October 22 - 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-4:00pm
Move out: 4:00pm-7:00pm

Click here to review Sponsorships and Exhibits
IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 

Click here for the latest floorplan


Current Exhibitor List:

ACCRETECH America, Inc.  #3
AEHR Test Systems  #7
AEMtec GmbH  #52
AI Technology  #11
Ajinomoto Fine-Techno USA Corporation  #4
Akrometrix, LLC  #44
Applied Microengineering Ltd
ASM Pacific Technology  #50
Axus Technology  #18
Cadence  #22
Camtek USA Inc  #15
Canon USA  #57
Chip Scale Review  #67
Condair  #26
CVInc.
cyberTECHNOLOGIES USA, LLC  #25
ERS electronic GmbH  #51
EV Group, Inc.  #36
Finetech  #23
Fraunhofer IIS/EAS  #5
Fraunhofer IZM  #41
FRT of America  #2
Heidelberg Instruments, Inc.  #40
Hitachi High-Tech Analytical Science  #48
IMAT, Inc.  #27
Integra Technologies  #54
JCET  #35
Kurdex Corporation  #46
LB Semicon  #62
Lintec of America, Inc.  #38
Lumina Instruments  #65
Mentor, A Siemens Business  #32
Mühlbauer, Inc.  #60
Neutronix-Quintel: NXQ  #21
Nikon Metrology  #10
Nordson SONOSCAN  #56
NSW Automation SDN. BHD.  #42
Open Sky Communications
PacTech USA Packaging Technologies Inc.  #28
PEKO Precision Products, Inc  #63
Plan Optik AG  #55
Plasma-Therm, LLC  #24
Practical Components  #31
Precision PCB Services, Inc.  #9
PURE TECHNOLOGIES  #19
Quartet Mechanics  #43
Rudolph Technologies  #30
SHENMAO Technology, Inc.  #12
Simco-Ion Technology Group  #49
SMTA  #68
Solarius, Inc.  #45
STARS MICROELECTRONICS  #59
Staubli Electrical Connectors, Inc.  #29
Suss MicroTec Inc.  #13
SVXR, Inc.  #58
Taiyo Ink Mfg Co., Ltd  #14
TechSearch International, Inc.  #20
Teikoku Taping System Inc  #53
Toray International America Inc.  #33
Unisem Inc.  #37
XPERI / Invensas  #34
Yield Engineering Systems, Inc.  #39
Yole Développement & System Plus Consulting  #17
Zuken, Inc.  #61

Questions?

Please contact Kim Newman from Chip Scale Review or Hannah Terhark from SMTA with questions or for more information.





Home | Top

Organized by: SMTA and ChipScale Review



Supported by:
IEEE Electronic Packaging Society

Supporting Media:
MEPTEC Open Sky Communications