Advanced Packaging in the New Connected World
October 22 - 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

IWLPC Executive Committee

Kim Newman

Kim Newman, Publisher, Chip Scale Review

A 15 year veteran at CSR, Kim joined the magazine's sales and marketing team in 1999. Kim assumed the Publisher role in 2007 and manages the public relations strategy and execution of programs for semiconductor packaging sector industry firms. Her overall responsibilities includes publication of all CSR generated media, oversight of technical content generation for contributed editorial and development of client and agency projects including marketing collateral in support of shows and industry events and are evidenced by the success of the International Wafer-level Packaging Conference (IWLPC) with additional acknowledgements by the leading trade venues. She is synonymous with the packaging industry. Her previous positions include sales operations management at Memorex Corporation. Kim graduated with a BS from the University of California at Davis.

Lawrence Michaels

Lawrence Michaels, Managing Director, Chip Scale Review

Lawrence became associated with CSR initially as a business and operations advisor in 2008 and joined fulltime in 2012. He brings with him a 20+ years of experience in senior systems engineering and a technical program management background from the Enterprise Business System and software industry. Additionally, he has held significant manufacturing and management positions in the avionics & aerospace industry. Lawrence holds a BS from University of Colorado and an MBA from California Lutheran University.

Tanya Martin

Tanya Martin, Executive Director, SMTA

Tanya joined the SMTA in 2014 and took over the leadership role of Executive Director in 2016. Tanya started her career 22 years ago at Digi-Key Corporation, a global electronics distributor, as a purchasing agent in the semiconductor segment. She then spent time as a manufacturer's representative firm in the Minneapolis area. In 2006 she accepted the position of Sales Manager at a regional contract manufacturer that also designed, assembled, and supported their own products.

Richard Coyle

Richard Coyle, Nokia Bell Labs and SMTA VP Technical Programs

Richard Coyle is a Consulting Member of the Technical Staff in the Reliability Engineering Organization of Nokia Bell Labs in Murray Hill, NJ. His work involves the reliability and quality of electronic assemblies. He received his Ph.D. in Metallurgical Engineering and Materials Science from the University of Notre Dame. He is a member of TMS, ASM international, the EPS of IEEE, AWS, the Board of Directors of iNEMI, and the Board of Directors of SMTA.

About Chip Scale Review

Chip Scale Review is the preeminent global magazine leading the way in middle-end and back-end technologies for advanced semiconductors covering device & wafer-level test, assembly & packaging. For over 20 years Chip Scale Review has continued to showcase industry leaders with exclusive editorial content that includes in-depth technical articles by leading industry technologists, market forecasts and updates from veteran industry analysts, research institutions, industry news, events and reviews. Also featured are international directories of equipment manufacturers, materials suppliers and service providers. Chip Scale Review also co-organizes the visionary International Wafer-Level Packaging Conference (IWLPC) with the SMTA.

  • Print: 14,800 copies/bi-monthly
  • Digital: 10,900 Subscribers
  • Trade Show: 3,540 (annual distribution)

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    About SMTA

    A non-profit international association of companies and individuals (totaling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

    The association is dedicated to the advancement of the electronics industry through member education and interaction. Local chapters are based in the United States Canada, Mexico, Brazil, India, Israel, Malaysia, Taiwan, and China.

    Educational programs, symposia, and seminars are held throughout the year in various locations in the United States, Canada, Mexico, China and Malaysia. The SMTA produces SMTA International, a major annual conference and exhibition currently held in Rosemont, IL (Late September - Early October).

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    Organized by: SMTA and ChipScale Review

    Supported by:
    IEEE Electronic Packaging Society

    Supporting Media:
    MEPTEC Open Sky Communications