Bridging the Boundaries: Wafer, Panel and Beyond
October 13 - 15, 2020
DoubleTree by Hilton San Jose
San Jose, California, USA

Panel Discussions

Tuesday, October 18

Jan Vardaman The Role for Large-Area Panel Processing in the Quest for Low-Cost FOWLP
Moderator: Jan Vardaman, TechSearch International, Inc.

  • Bernard Adams, STATS ChipPAC Inc.
  • David Butler, SPTS Technologies
  • Choon Lee, Lam Research
  • Urmi Ray, Qualcomm Technologies, Inc.

  • Wednesday, October 19th

    Urmi Ray Chip-Package Interaction (CPI) Challenges and Solutions for WLP and FOWLP
    Moderator: Urmi Ray, Qualcomm

  • Rama Alapati, Amkor Technologies
  • John Hunt, ASE
  • Paul Mescher, Microsoft
  • Jan Vardaman, TechSearch International, Inc.
  • Luu Nguyen, Texas Instruments

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    Organized by: SMTA and ChipScale Review

    Supported by:
    IEEE Electronic Packaging Society

    Supporting Media: