Lee Smith, Amkor Technology, Conference Chair
Andrew Strandjord, PacTech USA, General Chair
3D Integration
Francoise von Trapp, 3DIncites, 3D Integration Chair
Wafer-Level Packaging
Beth Keser, Qualcomm, WLP Track Chair
Luu Nguyen, National Semiconductor, WLP Track Co-Chair
Ted Tessier, FlipChip International
MEMS
Russell Shumway, Amkor Technology, MEMS Chair
Michelle Bourke, Kilbrydon, MEMS Co-Chair
Nick Leonardi, Premier Semiconductor Services
Ron Molnar, AZ Tech Direct
Marketing/Conference
Ken Gilleo, ET Trends LLC
Steve Greathouse, Plexus Corporation
Richard Haas, Richard Haas Marcom Consulting
Andy Mackie, Indium Corporation
Alan Rae, TPF Enterprises LLC
