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IWLPC Technical Committee
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Andrew Strandjord, PacTech USA, General Chair
Luu Nguyen, National Semiconductor, Technical Chair
Marketing/Conference
Steve Greathouse, Plexus Corporation
Richard Haas, Richard Haas Marcom Consulting
Andy Mackie, Indium Corporation
Alan Rae, TPF Enterprises LLC
3D Integration
Keith A. Cooper, SET North America, 3D Integration Chair
Peter Ramm, Fraunhofer EMFT, 3D Integration Co-Chair
Herb Reiter, eda 2 asic Consulting, Inc.
Zhaozhi(George) Li, Intel ATTD
Wafer-Level Packaging
Beth Keser, Qualcomm, WLP Track Chair
Ted Tessier, FlipChip International
Ravi Chilukuri, Amkor Technology
MEMS
Russell Shumway, Amkor Technology, MEMS Chair
Michelle Bourke, Kilbrydon, MEMS Co-Chair
Nick Leonardi, Premier Semiconductor Services
Ron Molnar, AZ Tech Direct
Roger Grace, Small Times Magazine
Maaike Taklo, SINTEF ICT
Tom Clifford, TJB Associates
Co-organizer of IWLPC
Kim Newman, Chip Scale Review
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IWLPC - The Package for Success
