Driving an Interconnected World
October 23 - 25, 2018
DoubleTree by Hilton San Jose
San Jose, California, USA
Registration Hours
Mon, Oct 22
3:00pm-7:00pm
Tue, Oct 23
7:00am-5:30pm
Wed, Oct 24
7:30am-5:30pm
Thu, Oct 25
7:30am-5:30pm

IWLPC Technical Committee

If you are interested in being part of the technical committee, contact Jenny Ng, jenny@smta.org or 952-920-7682.



Curtis Zwenger

General Chair: Curtis Zwenger, Amkor Technology

Curtis holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix. He has over 20 years of experience in the semiconductor industry and is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out and Glass Substrate product lines. Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and MEMS packaging technologies. Prior to joining Amkor, he worked for Motorola. Curtis has published several papers and has 12 patents related to semiconductor package engineering.




Chris Scanlan

Technical Chair: Chris Scanlan, Deca Technologies

Chris Scanlan has been Vice President of Product Management and Engineering at Deca Technologies since the company was founded in November 2009. Mr. Scanlan is responsible for design and development of Deca’s advanced wafer level packaging technologies and well as the development of Deca’s portfolio of intellectual property. He has been the lead inventor of Deca’s WLFO technology, including the M-Series fan-out package structure and Adaptive Patterning™ dynamic lithography technology. Prior to joining Deca Technologies, Mr. Scanlan was Vice President of Applications Engineering for Amkor Technology. During his 10 years at Amkor, he held senior leadership positions in advanced technology development including Vice President of Global R&D, Vice President of the Advanced Products Business Unit, and Vice President of the System-in-Package Business Unit. Mr. Scanlan has more than 40 US patents related to advanced semiconductor packaging.





3D Integration

Laurette Nacamulli

Chair: Laurette Nacamulli, The Dow Chemical Company

Laurette Nacamulli is Strategic Account Manager for Dow Chemical Electronic Materials – Advanced Packaging Technologies where she is responsible for promoting Dow’s packaging portfolio consisting of metallization and polymers. Laurette holds a BS in Chemistry and MS in electrochemistry both from Tel Aviv University, Israel. Previously, Laurette was a senior process engineer at Intel and held positions at Igen and Technicon developing electrochemical methods for diagnostics. She has authored papers and has a patent on electrochemiluminescence.




Peter Ramm

Co-Chair: Peter Ramm, Ph.D., Fraunhofer EMFT

Peter Ramm is head of Strategic Projects at the Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT in Munich, Germany, where he is responsible as well for the core competence "Silicon Technologies, Devices and 3D Integration." He received his Masters in physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility, where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, working mainly on integration technologies for innovative devices and heterogeneous systems with a specific focus on 3D TSV processes. Peter Ramm is co-author of over 100 publications and 24 patents. He is IMAPS fellow and received the Ashman Award "For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies." Peter Ramm is organizing committee & founding member of the IEEE 3DIC conference. He is co-editor of Wiley's "Handbook of Wafer Bonding" and Wiley´s book series "Handbook of 3D Integration".




Arun Aiyer

Arun Aiyer, Ph.D., Rudolph Technologies

pr. Arun Aiyer obtained his graduate degree from Indian Institute of Technology in Madras, India and his doctoral degree from University of Hull in the UK. Before coming to the semiconductor industry; Dr. Aiyer was with the Aerospace industry including the Jet Propulsion Laboratory. Since joining the semiconductor industry, he has been involved in the development of various wafer metrology and wafer inspection tools. He has twenty one patents to his credit. At present Dr. Aiyer is the Director of Program Management at Rudolph Technologies.




Sam Gu

Sam Gu, Ph.D., HUAWEI R&D USA

Sam Gu is a senior director at Futurewei Technologies Inc. of Huawei. Dr Gu has more than 20 years’ experience in the semiconductor industry and specializing in Si process development and integration, advanced memory IPs integration, and advanced package/system integration for network and wireless products. Prior to joining Huawei, he worked as a principal manager at Qualcomm and principal engineer at LSI Logic on semiconductor research, process development, and 2.xD and 3D system integration for ASIC and mobile products. He is the inventor of 70+ US patents. Dr. Gu received a BS from Nanjing University and a PhD in solid state physics from the University of Utah.




David Hiner

David Hiner, Amkor Technology Inc.

David Hiner is Senior Director of TSV Product Development at Amkor Technology. David has been with Amkor for 16 years and has served in various product director and managerial positions including supplier development and product platform and package development. He currently manages program and product development of 3D IC for mobile and memory applications. David has been issued 22 patents in the semiconductor packaging space and has multiple patent filings pending with the US patent office. He received his degree in chemical engineering from Arizona State University and his MBA from the University of Phoenix.




John Lau

John Lau, Ph.D., ASM Pacific Technology

John H. Lau has been a Senior Technical Advisor of ASM since July 2014. Prior to that, he was a Senior Scientist/MTS at HPL/Agilent in California, US for more than 25 years. With more than 37 years of R&D and manufacturing experience, he has authored more than 435 papers, 30 issued and pending patents, given more than 280 lectures/workshops/keynotes worldwide, and authored 20 textbooks in semiconductor packaging.




Herb Reiter, eda 2 asic Consulting, Inc.

After more than 20 years in technical and business roles at ASIC vendors and EDA software companies, Herb founded eda2asic Consulting, Inc. in 2002. Initially he focused on business development work to introduce products and services developed by mostly smaller EDA firms to major ASIC vendors. He introduced tools and IP for simplifying and accelerating SoC design efforts for integrating single die solutions into IC packages. Herb earned MSEE and MBA degrees in Austria/Europe, an MBA at San Jose State University and has attended 40+ Continuing Education Classes at Stanford University.




Jeremy Theil

Jeremy Theil, Invensas

Jeremy Theil leads external technology development for Invensas’ DBI technology. He has a PhD in Materials Science and Engineering from North Carolina State University, as well as a MS from University of Illinois at Urbana Champaign, and a BS from Carnegie-Mellon University. He has over 20 years of experience in scaling semiconductor-based technologies including CMOS images sensors, advanced interconnect materials, LEDs, and thin-film photovoltaics. He was also meeting chair of the 2015 Spring Materials Research Society meeting. Prior to Invensas he worked for Hewlett-Packard, Agilent Technologies, Philips Lumileds, and First Solar. He has published 37 papers including two review articles and 59 patents.




Dimitrios Velenis

Dimitrios Velenis, imec

Dimitrios Velenis is the leader of the 3D system design and signal analysis team at imec. He has been with imec for more than ten years where he was responsible for cost modeling and characterization of integration flows in 3D and Silicon Photonics interconnects. He has obtained M.Sc. and Ph.D. degrees from the University of Rochester. His Ph.D. work was awarded with the 2004 Outstanding Dissertation Award from the European Design Automation Association. Previously, Dimitrios worked as Assistant Professor at the ECE Department at Illinois Institute of Technology, and as a Research Associate at the University of Rochester. He is the author and coauthor of over 60 papers in journals and conference proceedings.




Seung Wook Yoon

Seung Wook Yoon, Ph.D., MBA, STATS ChipPAC

Dr. YOON is currently working for Products & Technology Marketing in STATS CHIPPAC LTD. His major interests are for wafer level products including eWLB/Fanout WLP, WLCSP, IPD (integrated Passive Device), flipchip bumping, TSV (Through Silicon Via), SiP and integrated 3D IC packaging. Prior to joining STATS CHIPPAC LTD, He was deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR (Agency of Singapore Technology and Research), Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 200 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging.





Wafer-Level Packaging

Saurabh Nilkanth Athavale

Chair: Saurabh Nilkanth Athavale, Ph. D., Maxim Integrated Products

Saurabh holds a Master’s degree in mechanical engineering and Doctoral degree in Industrial and Systems Science from State University of New York (Binghamton University). He has over 10 years of experience in the semiconductor industry and is currently involved in development of advanced wafer level packaging and board level reliability activities.




Tom Strothmann

Co-Chair: Tom Strothmann

Tom Strothmann is the former Director for Advanced Packaging Next-Generation Products at Kulicke & Soffa Industries, Inc. Prior to joining K&S, Tom managed Wafer Level Products Business Development for STATS ChipPAC, including Fan-In and Fan-Out WLP. Before STATS ChipPAC, Tom was Vice President of Business Development at FlipChip International and responsible for the formation of FlipChip Millennium Shanghai Co. At FlipChip Technologies, Tom successfully managed the transfer of bumping technology and the startup of bump lines for all major OSATS. Tom has 20 years’ experience in technology development for wafer bumping and related Advanced Packaging technologies and extensive experience in front end semiconductor manufacturing.




Jan Vardaman

Jan Vardaman, TechSearch International, Inc.

Jan Vardaman is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the US mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981.




Marion Volpert

Marion Volpert, CEA Leti

Marion holds a Master degree in Mechanical Engineering from the University of California, Santa Barbara as well as an Engineering diploma from the National Polytechnique Institut of Grenoble, France. She has been working at LETI since 2003 where she has over 10 years of experience in wafer level packaging. She is currently responsible for this activity in the Interconnect Laboratory for photonic devices, where she is developing advanced solutions for wafer bonding, thinning, TSVs, interposers and small bumps fabrication. Previously she worked on flip chip assemblies and issues related to very fine pitches as well as intermetallic. Prior to integrating LETI she worked at Digital Instruments on developing new profilometers and Atomic Force Microscopes. In these different subjects she is the author or co-author of more than 25 papers and several patents.





Advanced Manufacturing & Test

Shekar Krishnaswamy

Chair: Shekar Krishnaswamy, Applied Materials

Shekar has over 27 years of experience in all aspects of semiconductor manufacturing including wafer fab manufacturing, assembly and test. He started his career in IBM-Fishkill working in the advanced packaging segment focused on manufacturing multi-layer ceramic packages. His specific areas of expertise include traditional Industrial Engineering methods as well as systems related methodologies such as modeling, scheduling, dispatching and factory automation. Shekar has held senior technical and management positions at IBM, Motorola and AMD including management of corporate Operations Research departments supporting factory and service groups. Shekar has a Bachelor’s degree in Mechanical Engineering and a Master’s degree in Industrial Engineering and Operations Research.




Ira Feldman

Co-Chair: Ira Feldman, Feldman Engineering Corp.

Ira Feldman manages and develops unique high technology solutions and business strategies as a principal consultant at Feldman Engineering Corp. FEC supports clients with technical marketing and product generation processes. His expertise includes high volume manufacturing of complex technology products in the consumer electronics, semiconductor test, and computer test industries covering a wide size range of products and technologies from microfabricated 3D fully-assembled micro-machines to Automated Test Equipment (ATE) and mini-computers. Mr. Feldman has worked at both startups (NanoNexus and Microfabrica) and global companies (Hewlett-Packard and Agilent Technologies). He is the General Chair of the Burn-in & Test Strategies (BiTS) Workshop. And he earned BS and Master of Engineering degrees from Harvey Mudd College.




Dale Gee

Dale Gee

Dale holds a Bachelor's Degree in Chemical Engineering from UC Berkeley, and an MBA from Santa Clara University. Dale began his career at Motorola Semiconductors in 1982 as a Device Engineer and throughout the 1980s, 1990s, and 2000s held various engineering, management, and executive positions with integrated circuit, sensor, and MEMS companies including Hewlett-Packard, Foxboro/ICT, Nayna Networks, Symyx Technologies, Visyx Technologies, GE Sensing, and Amphenol-NovaSensor, where he held the position of Sr. Global Product Manager.




Habib Hichri

Habib Hichri, SÜSS MicroTec Inc.

Habib Hichri joined SUSS MicroTec on October 2013 as Engineering Applications Director in Corona CA, USA. Before joining SUSS MicroTec, Habib spend about 12 years with IBM Semiconductors Research and Development Center in East Fishkil, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management position within IBM on process development in lithography and Dry Reactive Ion Etch in the front end of line area for microprocessor fabrication. Habib holds over 35 U.S. patents and authored over 30 publications and presentations. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France and an MBA degree from the State University of New York at Buffalo.




Gerard John

Gerard John, Amkor Technology

Gerard joined Amkor in 2005, and has supported and managed hardware and software test development for a variety of Amkor packaging. He currently serves as an advanced test technical expert for MEMS, 2.5D, WLFO, HDFO, fine pitch probe and optical devices, supporting customers in the US and Europe. Prior to joining Amkor, Gerard worked in various semiconductor test positions for Conexant Systems, Flarion Technologies (acquired by Qualcomm) and Motorola. He holds a BA degree in electronics and telecommunications engineering from Osmania University and an MBA from Gainey School of Business in Michigan.




John Lannon

John Lannon, Ph.D., Micross Advanced Interconnect Technology

Dr. John Lannon is the General Manager of Micross Advanced Interconnect Technology, a business unit of Micross focused on wafer-level advanced packaging, interconnect, and device integration technologies. Since receiving his Ph.D. degree in Physics from WVU in 1996, he has worked on the development of thin film materials and advanced packaging processes (e.g. high density interconnects, TSV integration, and wafer-level vacuum packaging) for next generation microsystems in sensor and scene projector applications.




Subhasis Mukherjee

Subhasis Mukherjee, SanDisk

Subhasis Mukherjee holds PhD degree in Mechanical Engineering from University of Maryland, College Park. He has over 8 years of experience in semiconductor industry and academia and is currently working as Principal IC Packaging Engineer at SanDisk, a Western Digital Brand. He is responsible for mechanical and electrical design of NAND SIP packages and advancing the packaging technology, process, and new materials used in memory package assembly. He is active member of Electronic Packaging and Photonic Divison (EPPD) community at ASME. He has authored 6 Journal papers and more than 10 Conference papers. He has also received Outstanding Technical Paper award for his work on “Multi-scale modeling of anistropic creep response of SnAgCu single crystal solder” at International Conference on Electronic Packaging at Toyama, Japan, 2014.




Garrett Oakes

Garrett Oakes, EV Group

Garrett Oakes is the Director of Technology for EV Group North America in Tempe, Arizona. Since joining EV Group in 2006, he has held positions in Strategic Sales and Applications Engineering. In his current role, he is responsible for the day-to-day operations of the applications lab and managing the efforts of the engineering organization. Prior to EVG, he spent eleven years as a photolithography process and development engineer for IBM and Hitachi in their storage technology divisions. Garrett holds a degree in Chemical Engineering from the University of California at Davis. He also holds several U.S. patents on the subject of temporary bond and debond for back end wafer processing.








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Organized by: SMTA and ChipScale Review



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