IWLPC Technical Committee
If you are interested in being part of the technical committee, contact Jenny Ng, firstname.lastname@example.org or 952-920-7682.
General Chair: Curtis Zwenger, Amkor Technology
Curtis holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix. He has over 20 years of experience in the semiconductor industry and is currently responsible for the development and commercialization of Amkor’s Advanced Wafer Level Fan-Out and Glass Substrate product lines. Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and MEMS packaging technologies. Prior to joining Amkor, he worked for Motorola.
Curtis has published several papers and has 12 patents related to semiconductor package engineering.
Technical Chair: Chris Scanlan, Deca Technologies
Chris Scanlan has been Vice President of Product Management and Engineering at Deca Technologies since the company was founded in November 2009. Mr. Scanlan is responsible for design and development of Deca’s advanced wafer level packaging technologies and well as the development of Deca’s portfolio of intellectual property. He has been the lead inventor of Deca’s WLFO technology, including the M-Series fan-out package structure and Adaptive Patterning™ dynamic lithography technology. Prior to joining Deca Technologies, Mr. Scanlan was Vice President of Applications Engineering for Amkor Technology. During his 10 years at Amkor, he held senior leadership positions in advanced technology development including Vice President of Global R&D, Vice President of the Advanced Products Business Unit, and Vice President of the System-in-Package Business Unit. Mr. Scanlan has more than 40 US patents related to advanced semiconductor packaging.
Chair: Laurette Nacamulli, The Dow Chemical Company
Laurette Nacamulli is Strategic Account Manager for Dow Chemical Electronic Materials – Advanced Packaging Technologies where she is responsible for promoting Dow’s packaging portfolio consisting of metallization and polymers. Laurette holds a BS in Chemistry and MS in electrochemistry both from Tel Aviv University, Israel. Previously, Laurette was a senior process engineer at Intel and held positions at Igen and Technicon developing electrochemical methods for diagnostics. She has authored papers and has a patent on electrochemiluminescence.
Co-Chair: Peter Ramm, Ph.D., Fraunhofer EMFT
Peter Ramm is head of Strategic Projects at the Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT in Munich, Germany, where he is responsible as well for the core competence "Silicon Technologies, Devices and 3D Integration." He received his Masters in physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility, where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, working mainly on integration technologies for innovative devices and heterogeneous systems with a specific focus on 3D TSV processes. Peter Ramm is co-author of over 100 publications and 24 patents. He is IMAPS fellow and received the Ashman Award "For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies." Peter Ramm is organizing committee & founding member of the IEEE 3DIC conference. He is co-editor of Wiley's "Handbook of Wafer Bonding" and Wiley´s book series "Handbook of 3D Integration".
Brian Bircumshaw, exo-imaging
David Henry, CEA LETI Minatec
David Hiner, Amkor Technology Inc.
David Hiner is Senior Director of TSV Product Development at Amkor Technology. David has been with Amkor for 16 years and has served in various product director and managerial positions including supplier development and product platform and package development. He currently manages program and product development of 3D IC for mobile and memory applications. David has been issued 22 patents in the semiconductor packaging space and has multiple patent filings pending with the US patent office. He received his degree in chemical engineering from Arizona State University and his MBA from the University of Phoenix.
Dong Wook Kim, HUAWEI R&D USA
John Lau, Ph.D., ASM Pacific Technology
John H. Lau has been a Senior Technical Advisor of ASM since July 2014. Prior to that, he was a Senior Scientist/MTS at HPL/Agilent in California, US for more than 25 years. With more than 37 years of R&D and manufacturing experience, he has authored more than 435 papers, 30 issued and pending patents, given more than 280 lectures/workshops/keynotes worldwide, and authored 20 textbooks in semiconductor packaging.
Anup Pancholi, Intel Corporation
Herb Reiter, eda 2 asic Consulting, Inc.
After more than 20 years in technical and business roles at ASIC vendors and EDA software companies, Herb founded eda2asic Consulting, Inc. in 2002. Initially he focused on business development work to introduce products and services developed by mostly smaller EDA firms to major ASIC vendors. He introduced tools and IP for simplifying and accelerating SoC design efforts for integrating single die solutions into IC packages. Herb earned MSEE and MBA degrees in Austria/Europe, an MBA at San Jose State University and has attended 40+ Continuing Education Classes at Stanford University.
Jeremy Theil, Invensas
Jeremy Theil leads external technology development for Invensas’ DBI technology. He has a PhD in Materials Science and Engineering from North Carolina State University, as well as a MS from University of Illinois at Urbana Champaign, and a BS from Carnegie-Mellon University. He has over 20 years of experience in scaling semiconductor-based technologies including CMOS images sensors, advanced interconnect materials, LEDs, and thin-film photovoltaics. He was also meeting chair of the 2015 Spring Materials Research Society meeting. Prior to Invensas he worked for Hewlett-Packard, Agilent Technologies, Philips Lumileds, and First Solar. He has published 37 papers including two review articles and 59 patents.
Seung Wook Yoon, Ph.D., MBA, STATS ChipPAC
Dr. YOON is currently working for Products & Technology Marketing in STATS CHIPPAC LTD. His major interests are for wafer level products including eWLB/Fanout WLP, WLCSP, IPD (integrated Passive Device), flipchip bumping, TSV (Through Silicon Via), SiP and integrated 3D IC packaging. Prior to joining STATS CHIPPAC LTD, He was deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR (Agency of Singapore Technology and Research), Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 200 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging.
Co-Chair: Luu Nguyen, Ph.D., Texas Instruments
Luu Nguyen is a TI Fellow at Texas Instruments, working on sensors, printed electronics, high voltage packaging, precision analog, design-for-manufacturability, and wafer level packaging. He received his Ph.D. in Mechanical Engineering from MIT, and has worked at IBM Research and Philips Research. He coedited two books on packaging, and has over 200 publications. He has over 70 patents and invention disclosures. He is a Fellow of IEEE and ASME, and a Fulbright Scholar (Finland 2002). He received two Best of Conference Awards, one Best Poster of Conference Award, and eight IMAPS and IEMT Best of Session Conference Awards. He received the 2004 IEEE CPMT Outstanding Sustained Technical Contributions Award. Other awards also include the 2003, 2014, 2015, and 2016 Mahboob Khan Outstanding Mentor Award from the Semiconductor Research Corporation in recognition of contributions to student mentoring, research collaboration, and technology transfer.
Co-Chair: Tom Strothmann, Kulicke & Soffa
Tom Strothmann is the Director for Advanced Packaging Next-Generation Products at Kulicke & Soffa Industries, Inc. Prior to joining K&S, Tom managed Wafer Level Products Business Development for STATS ChipPAC, including Fan-In and Fan-Out WLP. Before STATS ChipPAC, Tom was Vice President of Business Development at FlipChip International and responsible for the formation of FlipChip Millennium Shanghai Co. At FlipChip Technologies, Tom successfully managed the transfer of bumping technology and the startup of bump lines for all major OSATS. Tom has 20 years’ experience in technology development for wafer bumping and related Advanced Packaging technologies and extensive experience in front end semiconductor manufacturing.
Vivek Dutta, Ph.D., Ormet Circuits Inc.
Dr. Vivek Dutta received his Ph.D. from the University of California, Berkeley. He has more than 35 years of experience in Microelectronics, Display, LED, Alternate Energy, Pharmaceutical and Metallurgical Industries. Vivek began his semiconductor career in Silicon Valley, working in Packaging & Interconnect areas at National Semiconductor. While he was the CEO of Advanpack Solutions (APS) in Singapore, Vivek introduced the pillar bump technology to the industry ~ which has become the foundation for next generation flip chip Assembly. He is currently working with Ormet Circuits, Inc. (a subsidiary of Merck KGaA) as Principal Technologist supporting the activities related to strategy, business, and technology development for back-end materials to address the next generation of microelectronics assembly needs.
Jie Gong, Ph.D., KLA-Tencor
Dr. Jie Gong received his Ph.D in Mechanical Engineering from Georgia Institute of Technology in 2016. His PhD research focuses on the non-destructive testing of solder joint quality and reliability. He has authored or co-authored several publications on various journals in the area of electronic packaging. Dr. Gong has been worked in KLA-Tencor Corporation as a Senior Application Development Engineer since 2014. His job in KLA-Tencor primarily focuses on development of state-of-art wafer inspection tool. He works very closely with front and back-end foundry customers all over the world. He has gained a lot of experience on semiconductor quality and reliability, defect inspection, semiconductor processing like wafer level packaging and TSV.
Steven Xu, Ph.D., Qualcomm
Steven Xu, Ph.D., is the package engineering manager and head of wafer level packaging at Qualcomm, responsible for technology development, NPI product qualification, and foundry / OSAT management of wafer level packages. He is one of the key contributors driving Qualcomm's industry leadership in both fan-in and fan-out wafer level packages. Dr. Xu received the Ph.D. degree in Materials Science & Engineering from Georgia Institute of Technology. He has 50+ technical publications and 10+ granted patents. Dr. Xu was the General Chair of the IWLPC Conference in 2015.
Jan Vardaman, TechSearch International, Inc.
Jan Vardaman is the editor of Surface Mount Technology: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She served on the NSF-sponsored World Technology Evaluation Center study team involved in investigating electronics manufacturing in Asia and on the US mission to study manufacturing in China. She is a member of IEEE CPMT, IMAPS, SMTA, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. She received her BA in Economics and Business from Mercer University in Macon, Georgia in 1979 and her MA in Economics from the University of Texas at Austin in 1981.
Marion Volpert, CEA Leti
Marion obtained an engineering diploma from the Polytechnique National Institut (INPG) of Grenoble in 1997, majoring in Fluid Mechanics and obtained a Master degree at UCSB in Mechanical Engineering in June 2000. She worked for two years at Digital Instruments in the engineering division developing new profilometers and Atomic Force Microscopes. She joined the interconnect laboratory at LETI in February 2003 to work on various projects with complex interconnection challenges. In 2007, she specialized in wafer level packaging and issues related to very fine pitches, wafer bonding and wafer thinning. She has become since responsible of this activity, developing new technologies for fine pitch micro-bumps, µtubes, TSVs, and interposers. In these different subjects she is the author or co-author of more than 25 papers and several patents.
Advanced Manufacturing & Test
Chair: Shekar Krishnaswamy, Applied Materials
Shekar has over 27 years of experience in all aspects of semiconductor manufacturing including wafer fab manufacturing, assembly and test. He started his career in IBM-Fishkill working in the advanced packaging segment focused on manufacturing multi-layer ceramic packages. His specific areas of expertise include traditional Industrial Engineering methods as well as systems related methodologies such as modeling, scheduling, dispatching and factory automation. Shekar has held senior technical and management positions at IBM, Motorola and AMD including management of corporate Operations Research departments supporting factory and service groups. Shekar has a Bachelor’s degree in Mechanical Engineering and a Master’s degree in Industrial Engineering and Operations Research.
Co-Chair: Ira Feldman, Feldman Engineering Corp.
Ira Feldman manages and develops unique high technology solutions and business strategies as a principal consultant at Feldman Engineering Corp. FEC supports clients with technical marketing and product generation processes. His expertise includes high volume manufacturing of complex technology products in the consumer electronics, semiconductor test, and computer test industries covering a wide size range of products and technologies from microfabricated 3D fully-assembled micro-machines to Automated Test Equipment (ATE) and mini-computers. Mr. Feldman has worked at both startups (NanoNexus and Microfabrica) and global companies (Hewlett-Packard and Agilent Technologies). He is the General Chair of the Burn-in & Test Strategies (BiTS) Workshop. And he earned BS and Master of Engineering degrees from Harvey Mudd College.
Dale holds a Bachelor's Degree in Chemical Engineering from UC Berkeley, and an MBA from Santa Clara University. Dale began his career at Motorola Semiconductors in 1982 as a Device Engineer and throughout the 1980s, 1990s, and 2000s held various engineering, management, and executive positions with integrated circuit, sensor, and MEMS companies including Hewlett-Packard, Foxboro/ICT, Nayna Networks, Symyx Technologies, Visyx Technologies, GE Sensing, and Amphenol-NovaSensor, where he held the position of Sr. Global Product Manager. Dale is currently doing contract work with ON Semiconductor on their MEMS-based 6 DOF integrated motion sensors.
Habib Hichri, SÜSS MicroTec Inc.
Gerard John, Amkor Technology
Gerard joined Amkor in 2005, and has supported and managed hardware and software test development for a variety of Amkor packaging. He currently serves as an advanced test technical expert for MEMS, 2.5D, WLFO, HDFO, fine pitch probe and optical devices, supporting customers in the US and Europe. Prior to joining Amkor, Gerard worked in various semiconductor test positions for Conexant Systems, Flarion Technologies (acquired by Qualcomm) and Motorola. He holds a BA degree in electronics and telecommunications engineering from Osmania University and an MBA from Gainey School of Business in Michigan.
John Lannon, Ph.D., Micross Advanced Interconnect Technology
Dr. John Lannon is the General Manager of Micross Advanced Interconnect Technology, a business unit of Micross focused on wafer-level advanced packaging, interconnect, and device integration technologies. Since receiving his Ph.D. degree in Physics from WVU in 1996, he has worked on the development of thin film materials and advanced packaging processes (e.g. high density interconnects, TSV integration, and wafer-level vacuum packaging) for next generation microsystems in sensor and scene projector applications.
Subhasis Mukherjee, SanDisk
Garrett Oakes, EV Group
Garrett Oakes is the Director of Technology for EV Group North America in Tempe, Arizona. Since joining EV Group in 2006, he has held positions in Strategic Sales and Applications Engineering. In his current role, he is responsible for the day-to-day operations of the applications lab and managing the efforts of the engineering organization. Prior to EVG, he spent eleven years as a photolithography process and development engineer for IBM and Hitachi in their storage technology divisions. Garrett holds a degree in Chemical Engineering from the University of California at Davis. He also holds several U.S. patents on the subject of temporary bond and debond for back end wafer processing.