Lee Smith, Amkor Technology, Conference Chair
Andrew Strandjord, PacTech USA, General Chair
3D Integration
Christo Bojkov, Freescale Semiconductor, 3D Integration Chair
Francoise von Trapp, 3DIncites, 3D Integration Co-Chair
Wafer-Level Packaging
Rex Anderson, Amkor Technology, WLP Track Chair
Beth Keser, Qualcomm, WLP Track Co-Chair
Ted Tessier, FlipChip International
Luu Nguyen, National Semiconductor
MEMS
Russell Shumway, Amkor Technology, MEMS Chair
Michelle Bourke, Kilbrydon, MEMS Co-Chair
Ron Edgar, Chip Scale Review magazine
Marketing/Conference
Ken Gilleo, ET Trends LLC
Steve Greathouse, Plexus Corporation
Richard Haas, Richard Haas Marcom Consulting
Andy Mackie, Indium Corporation
Alan Rae, TPF Enterprises LLC
