Amkor is one of the world’s largest providers of contract semiconductor assembly and test services. Founded in 1968, Amkor pioneered the outsourcing of IC assembly and test and is now a strategic manufacturing partner for more than 200 of the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 5 million square feet of floor space with production facilities, product development centers and sales & support offices located in key electronics manufacturing regions in Asia, Europe and the United States.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
NEXX Systems was founded in August 2001 through the acquisition from MKS Instruments of the ASTeX systems group, including the purchase of the Nimbus product line of sputter deposition systems for PVD of thin films. With the acquisition of All-Wet Technologies in April 2003, NEXX Systems enhanced its product offering to include leading edge, low cost, high performance electrodeposition technology for metal and photoresist.
Pac Tech Packaging Technologies is a worldwide leader in both Wafer Level Packaging Services and in Wafer Level Packaging Equipment. Pac Tech has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia. These sites can supply both engineering and prototyping services, as well as high volume production. Pac Tech is structured to provide a single source for all contract Bumping Services, as well as providing turn key Wafer Level Packaging Equipment.
The core technologies that Pac Tech offers are centered around Electroless Nickel/Gold Bumping and Laser Based Solder Deposition (services and equipment).
Pac Tech's philosophy is to integrate its leading technology developments into high quality equipment for high volume production.
Since it's inception in 1943, Technic Inc. has remained a financially strong private corporation and has established a global reputation for technical excellence in the electro-deposition of precious metals.
Technic supplies the most advanced wafer chemistry, processing equipment and analytical controls in the industry. High performance product development with application specific characteristics and unparalleled analytical expertise provides customers with the essential tools to meet the challenges of today’s semiconductor manufacturing.
