Event SponsorsWe couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor!
XPERI / InvensasInvensas Corporation enables tomorrow's semiconductor technologies by inventing, productizing and acquiring strategic intellectual property (IP) to solve critical roadmap problems. Focus areas include circuitry design, memory modules, packaging, 3-D systems, and advanced interconnect technologies, targeting the mobile, storage and consumer electronics sectors.
NanotronicsNanotronics helps their customers improve yield, reduce footprint and scrap, and iterate on their processes faster. We automate industrial microscopes used for inspection of the world's smallest technologies: semiconductors, microchips, hard drives, LEDs, nano-fillers, nanotubes, and more. nSpec® is an integrated part of production processes at many of the world's leading manufacturers. nSpec® is powered by advanced computer vision, machine learning, and artificial intelligence software analyzers to deliver maximum value and capability at lower cost.
SUSS MicroTecSUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.
EV GroupEV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
PAC TECHPackaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.
100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).