Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
Deca Technologies is an electronic interconnect solutions provider that initially offers wafer level chip scale packaging (WLCSP) services to the semiconductor industry. Integrating solar and semiconductor technology, Deca leverages unique equipment, processes and operational methods inspired by SunPower to address some of the significant barriers to the continued adoption and growth of next generation interconnects.
NANIUM is dedicated to providing development, manufacturing, testing and engineering services in the semiconductor business, operating namely in WLP/RDL and in traditional substrate and leadframe based packages
Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany. 100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.
Silver Sponsor
Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company's Dow Corning® and XIAMETER® (www.xiameter.com) brands.
Sonoscan is the most trusted authority on the application of Acoustic Microscopy and Acoustic Micro Imaging (AMI) for nondestructive inspection and analysis, and provides customers with the highest quality scanning acoustic microscopes and technology, as well as a full range of analytical and testing services.
International Wafer-Level Packaging Conference
