We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor!
Nanotronics helps their customers improve yield, reduce footprint and scrap, and iterate on their processes faster. We automate industrial microscopes used for inspection of the world's smallest technologies: semiconductors, microchips, hard drives, LEDs, nano-fillers, nanotubes, and more. nSpec® is an integrated part of production processes at many of the world's leading manufacturers. nSpec® is powered by advanced computer vision, machine learning, and artificial intelligence software analyzers to deliver maximum value and capability at lower cost.
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
From 5G mobile network solutions and intelligent LED lighting in our automobiles, to Gesture Recognition Capability and EMI shielding for our smart phones, our thin film deposition systems enable manufacture of the worlds highest performance, semiconductor, optoelectronic and optical devices. Advanced Packaging production solutions on HEXAGON and CLUSTERLINE deliver high yield UBM / RDL processes with stable low Rc values at throughputs up to 56 wph in FOWLP. Combining our latest atmospheric batch degas, etch and deposition technologies enables our customers to achieve the even lower Rc values needed for contacts and interconnects required next generation power management in IOT applications.
nepes provides Full Turnkey Solutions for Flip-Chip Bumping, FI/FO-WLP (w/ Redistribution) Versatile solutions provided in conjunction with Wafer Sort/Backend Assembly process.
Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.
100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).
As a leading manufacturer of microscopes ZEISS offers inspiring solutions and services for your life sciences and materials research, education and clinical routine. Reliable ZEISS systems are used for manufacturing and assembly in high tech industries as well as exploration and processing of raw materials worldwide. Choose the ideal solution for your tasks and applications from a broad spectrum of light, confocal, electron and X-ray microscopes. Highly skilled and well trained application specialists support your work and make sure you get the most out of your investment.
AMICRA Microtechnologies GmbH
We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.
Amkor Technology, Inc. is one of the world’s largest providers of state-of-the-art packaging design, assembly and test services and is a turnkey provider and packaging technology partner to leading semiconductor companies and electronics OEMs. Founded in 1968, Amkor’s global operations include over 8M ft2 of volume production, development, sales and support services. Visit www.amkor.com.
As a leading supplier of wafer fabrication equipment and services to the global semiconductor industry, Lam Research develops innovative solutions that help our customers build smaller, faster, and more power-efficient electronic devices—the kind that are driving the proliferation of technology into our everyday lives. Lam Research offers a broad portfolio of market-leading thin film deposition, plasma etch, photoresist strip, and wafer cleaning solutions for front-end wafer processing and advanced packaging applications. Comprehensive customer support offerings deliver value throughout the equipment lifecycle, from system installation, production ramp, and new technology upgrades through end-of-life asset management. Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology.
Tote Bag Sponsor
Toray International, Inc.
Established in 1986 to serve as the trading arm of the Toray Group, Toray International handles a wide range of products and services, from materials to end-user consumer goods, by drawing on the experience and know-how accumulated and built over the years through global trading business and business offices located in Japan and abroad..
Charging Station Sponsor
Johnstech is the world's leading provider of high performance final test solutions for the wafer and package semiconductor industry, with sales and service locations around the globe. Johnstech has a strong global patent portfolio with 89 patents issued, and an additional 71 pending. We test more than 6 Billion IC devices annually.
Refreshment Day 1 Sponsor
SHENMAO America, Inc.
SHENMAO America, Inc. is an American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. For over 43 years, SHENMAO is a global leader in solder materials with 10 manufacturing, technical, and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, USA, supporting a wide range of products for the semiconductor and PCBA industries. As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, LED Die Bonding Solder Paste and PV Ribbon.
Refreshment Day 2 Sponsor
Akrometrix is the worldwide leader of PCB and component thermal warpage metrology systems and test services for the electronics industry. We measure at-room-temperature warpage,thermal warpage, and thermal strain of substrates, materials, and electronic components and assemblies at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical, and tabular results to prove compliance to industry standards.
Day 1 Keynote Sponsor
EMD Performance Materials
EMD Performance Materials, a subsidiary of Merck KGaA, Darmstadt, Germany, offers a wide range of specialty chemicals for various markets, such as liquid crystals for displays, effect pigments for coatings and cosmetics, and specialty materials to enable the latest advances in the microelectronics industry. EMD Performance Materials is focused on value added formulations which address the challenging advanced packaging device requirements. These product offerings include spin on dielectrics (PHPS), lithography yield enhancers (Rinses, Shrinks, underlayers), photoresists for etch, plating, and lift-off applications, silica products, sintered pastes and other ancillary products for the production of integrated circuits.
Notepad and Pen Sponsor
LB Semicon is a Flip Chip Bumping company that has whole process of wafer bumping which is a first in Korea. The Company's mission is to be a Total Solution Provider of Flip Chip technology
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech's Inkjet solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit www.spts.com and www.orbotech.com.