Advanced Packaging in the New Connected World
October 22 - 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

Event Sponsors

We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor!

Platinum Sponsor


SUSS MicroTec

SUSS MicroTec

SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.


Gold Sponsors


EV Group

EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.


PAC TECH

Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.
100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).


Silver Sponsor


LAM Research

LAM Research

As a trusted, collaborative partner to the world's leading semiconductor companies, Lam Research is a fundamental enabler of the silicon roadmap.


Reception Sponsor


Simco-Ion

Simco-Ion

Simco-Ion, the world's largest supplier of static control and monitoring solutions offers a comprehensive portfolio of ISO-designed ionizers and digital controllers to address electrostatic charge/discharge problems in clean manufacturing environments. We offer product solutions to address Industry 4.0 requirements and new manufacturing processes. Our Novx products provide real-time monitoring, analyze, and control ionization while providing production traceability and control. Innovative products, specially designed to operate in extreme temperatures and critical environments, meet or exceed ISO cleanroom standards. Exclusive in the industry! We offer custom evaluations; a full diagnostics service by our experienced engineers and renowned applications specialist to develop a total solutions package to manage your electrostatic challenges, improve operations, increase product yield and control cost.


Lunch Day 1 Sponsor


Akrometrix

Akrometrix

Akrometrix is the worldwide leader of PCB and component thermal warpage metrology systems and test services for the electronics industry. We measure at-room-temperature warpage,thermal warpage, and thermal strain of substrates, materials, and electronic components and assemblies at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical, and tabular results to prove compliance to industry standards.


Keynote Sponsors


Invensas

XPERI / Invensas

Invensas Corporation enables tomorrow's semiconductor technologies by inventing, productizing and acquiring strategic intellectual property (IP) to solve critical roadmap problems. Focus areas include circuitry design, memory modules, packaging, 3-D systems, and advanced interconnect technologies, targeting the mobile, storage and consumer electronics sectors.


Tote Bag Sponsor


LB Semicon

LB Semicon

LB Semicon was the first company in Korea to start business in the flip-chip wafer bumping field with all necessary production facilities established. Starting with gold bumping for TFT LCD & OLED Display Driver IC (DDI), LB Semicon has expanded its scope into Solder bumping, Cu pillar bumping, and even Wafer Level Chip Scale Package (WLCSP) by continuously developing its flip-chip bumping technology. With its cutting-edge technology and spirit of enterprise, LB Semicon promises to serve as a company that provides products and services of the highest quality so that we can move forward alongside our customers.


Lanyard Sponsor


JCET

Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET), the third largest OSAT in the world, provides innovative packaging and test solutions for semiconductor companies with a comprehensive product portfolio that includes discrete, leaded, wirebond, flip chip, Micro-Electro-Mechanical Systems (MEMS) and sensors, Integrated Passive Devices (IPD), Molded Interconnect System (MIS), advanced wafer level packaging (WLP), 2.5D/3D solutions and System-in-Package (SiP) solutions. Headquartered in Jiangyin, China, JCET has an extensive global manufacturing base with operational centers in China, Singapore and South Korea.






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Organized by: SMTA and ChipScale Review



Supported by:
IEEE Electronic Packaging Society Panel Level Packaging Consortium

Supporting Media:
MEPTEC Open Sky Communications