We couldn't have an event this good without the dedication and support of our sponsors and exhibitors. If you would like to see your company listed on this page, sign up to become a sponsor!
XPERI / Invensas
Invensas Corporation enables tomorrow's semiconductor technologies by inventing, productizing and acquiring strategic intellectual property (IP) to solve critical roadmap problems. Focus areas include circuitry design, memory modules, packaging, 3-D systems, and advanced interconnect technologies, targeting the mobile, storage and consumer electronics sectors.
Nanotronics helps their customers improve yield, reduce footprint and scrap, and iterate on their processes faster. We automate industrial microscopes used for inspection of the world's smallest technologies: semiconductors, microchips, hard drives, LEDs, nano-fillers, nanotubes, and more. nSpec® is an integrated part of production processes at many of the world's leading manufacturers. nSpec® is powered by advanced computer vision, machine learning, and artificial intelligence software analyzers to deliver maximum value and capability at lower cost.
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
Packaging Technologies GmbH (PAC TECH), a group member of NAGASE & CO., Ltd., is a world-leading manufacturer of advanced wafer bumping, packaging, and solder ball placement equipment, including innovative Laser Assisted Solder-Jetting solutions. PAC TECH also specializes in low cost contract services for electroless under-bump-metallization (UBM) and solder ball placement. PAC TECH Headquarters: Nauen, Germany.
100% subsidiaries: PAC TECH USA - Packaging Technologies Inc. (Silicon Valley, USA) & PAC TECH ASIA Sdn. Bhd. (Penang, Malaysia).
AMICRA Microtechnologies GmbH
We provide customers with extraordinary, high-technological engineering services, specializing in the latest High-precision die bonder and flip chip bonder technology, wafer inking systems, dispense and test systems as well as products for the entire industry field of microelectronics, including:active optical cable, fan-out, TSV, TCB, process development, silicon photonics, semiconductor backend, fiber optic, LED, opto electronics, and MEMS.
Amkor Technology, Inc. is one of the world’s largest providers of state-of-the-art packaging design, assembly and test services and is a turnkey provider and packaging technology partner to leading semiconductor companies and electronics OEMs. Founded in 1968, Amkor’s global operations include over 8M ft2 of volume production, development, sales and support services. Visit www.amkor.com.
Lunch Day 1 Sponsor
KYEC provides full turn-key test services and have over 3500 testers within the dedicated test business units strategically located at the heart of the world's largest wafer foundries in Taiwan. KYEC offers cost-effective and complete test solutions thus reducing investment and operating costs whilst gaining additional capacity. Our services are available for a wide range of applications including RF, Mixed-Signal, Digital, Memory, CIS/CCD and SOC. Reliability and prototype production test are also supported by KYEC's Test Development centers.
Refreshment Day 1 Sponsor
SHENMAO America, Inc.
SHENMAO America, Inc. is an American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. For over 43 years, SHENMAO is a global leader in solder materials with 10 manufacturing, technical, and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, USA, supporting a wide range of products for the semiconductor and PCBA industries. As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Laser Soldering Paste, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux, LED Die Bonding Solder Paste and PV Ribbon.
Refreshment Day 2 Sponsor
Akrometrix is the worldwide leader of PCB and component thermal warpage metrology systems and test services for the electronics industry. We measure at-room-temperature warpage,thermal warpage, and thermal strain of substrates, materials, and electronic components and assemblies at critical reflow temperatures. Akrometrix equipment is capable of providing graphical, statistical, and tabular results to prove compliance to industry standards.
Notepad and Pen Sponsor
LB Semicon is a Flip Chip Bumping company that has whole process of wafer bumping which is a first in Korea. The Company's mission is to be a Total Solution Provider of Flip Chip technology
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech's Inkjet solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit www.spts.com and www.orbotech.com.