IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for many of the world's leading semiconductor companies and electronics OEMs, providing a broad array of advanced package design, assembly and test solutions. Amkor offers a suite of services, including electroplated wafer bumping, probe, assembly and final test. Amkor is a leader in advanced copper pillar bump and packaging technologies which enables next generation flip chip interconnect.
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lithography(NIL), metrology, photoresist coating, cleaning and inspection equipment.
NEXX Systems was founded in August 2001 through the acquisition from MKS Instruments of the ASTeX systems group, including the purchase of the Nimbus product line of sputter deposition systems for PVD of thin films. With the acquisition of All-Wet Technologies in April 2003, NEXX Systems enhanced its product offering to include leading edge, low cost, high performance electrodeposition technology for metal and photoresist.
NANIUM is dedicated to providing development, manufacturing, testing and engineering services in the semiconductor business, operating namely in WLP/RDL and in traditional substrate and leadframe based packages
Pac Tech Packaging Technologies is a worldwide leader in both Wafer Level Packaging Services and in Wafer Level Packaging Equipment. Pac Tech has over 15 years of experience in the industry and has manufacturing sites all around the world, including: Germany, United States, Japan, and Malaysia. These sites can supply both engineering and prototyping services, as well as high volume production. Pac Tech is structured to provide a single source for all contract Bumping Services, as well as providing turn key Wafer Level Packaging Equipment.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
SUSS MicroTec Group is a supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. The solution portfolio covers all performance relevant steps for wafer processing ranging from coating, baking, developing, aligning to wafer bonding and is complemented by specialised add-ons such as photomasks, nanoimprint lithography tools and optical lenses.
IWLPC - The Package for Success
