Living Connected Through Trillions Sensors
Dr. Janusz Bryzek, Chair, TSensors Summit
Tuesday, November 11, 2014 | 8:00am - 9:00am, Oak Ballroom
We are witnessing the emergence of largest economic tide in history of humans, the Internet of Everything including eHealth. The magnitude of this global tide is estimated at $19 trillion by 2020, exceeding the size of today’s US economy.
The foundation for these global tides are sensors. Sensor use in mobile market grew to 10 billion units/year today, up from 10 million in 2007 (iPhone introduction). The Abundance (movement aiming at elimination of major global problems (such as hunger and lack of medical care) forecasts the demand for sensors to grow to 45 trillion in two decades. TSensors (Trillion Sensors) Initiative has emerged, aiming at acceleration of new sensor commercialization to support Abundance needs.
Sensors are starting to invade every aspect of our live, generating massive amounts of (Big) data. Consumer products already are using about 100 sensor types. Sensor derived data moving through the Cloud, Fog and Swarm networks is expected to reach a BrontoByte (1027) enabling Analytics on the unprecedented scale, and enabling prediction of our needs through Machine Learning algorithms running on quantum computers.
Sensors are one of the eight exponential technologies enabling growth of goods and services faster than growth of demand for them. Exponential technologies enable Exponential Organizations (ExO), which demonstrated sales growth to billion dollars in one to three years. New Exponential organizations are expected to replace 40% of Fortune 500 companies in coming decade, in a similar mode to Kodak replacement by Instagram in 2012.
This presentation will discuss these issues in more details and present an amazing showcase of available sensor based products.
Panel Discussion – Sponsored by
System Level Advantages of 3D Integration
Tuesday, November 11, 2014 | 1:15pm – 2:45pm, Oak Ballroom
For years the industry has discussed and debated 3D integration technologies, discussing the market drivers, technology challenges, supply chain issues, and above all, the cost. As the roadmaps continued to be pushed out, manufacturers, suppliers, and R&D centers have addressed these concerns, and foundries and OSATS have declared themselves ready to ramp production. But still, commercialization lags, waiting for system-level integrators to design in 3D ICs.
In this panel, end-users and manufacturers will face-off in a discussion about the system-level advantages of 3D IC, whether 3D ICs can solve the issues of SoC design complexity and the cost of CMOS scaling to future nodes. The audience will participate in a real-time poll to gauge current industry understanding of these advantages, and the panelists will be invited to present their perspectives on the same polling questions.
Moderator: Francoise von Trapp, 3D InCites, Inc. Rama Alapati, GlobalFoundries
Rozalia Beica, Yole Développement
Simon McElrea, Invensas Corporation
More to Announce
Tuesday, November 11, 2014 | 5:30pm – 7:30pm
Join us in the Bayshore Ballroom for the Exhibitor Reception on Tuesday Nov 11th (5:30pm - 7:30 p.m.) where the 50 + exhibitors will showcase the latest products and technologies offered by leading companies in the semiconductor packaging industry. The evening reception offers attendees numerous opportunities for networking and discussion with colleagues.
Plenary — Wearable, Wireless Health Solutions and Related Packaging Challenges
Mehran Mehregany, Ph.D., Case Western Reserve University
Wednesday, November 12, 2014 | 8:00am–9:00am, Oak Ballroom
Chronic diseases account for 75%+ of the US health care expenditures, i.e., $2 trillion. In the U.S., 141 million (45% of the population) have at least one chronic disease, 72 million of which have two or more. Top 10 significant chronic diseases are: hypertension, obesity, arthritis, asthma, chronic kidney disease, depression, chronic obstructive pulmonary disease (COPD), diabetes, sleep disorder and heart failure.
Use of sensor-enabled wearable wireless health solutions to monitor the health condition of chronic disease patients is key to the quality of life of the patient and to reduction of cost of health care—by keeping the patient out of the hospital and emergency rooms. Additionally, monitoring for early intervention is key to avoiding long-term adverse outcomes for those at risk of developing chronic diseases. This presentation will elaborate on the application opportunity and the important role that packaging plays in fielding successful wearable wireless health products.
Plenary - Wafer-Level Packaging Innovations to Enable Wearable Electronics
Theodore (Ted) G. Tessier, Flip Chip International, LLC
Wednesday, November 12, 2014 | 1:15pm – 2:15pm, Oak Ballroom
As has often been the case in the electronics industry, jargon like "Wearable Electronics" is quickly adopted to define revolutionary advances in novel functionality and form factors which in turn have enabled dramatic advancements in mankind’s quality of life and / or convenience. These advancements are made possible through the continual strides that are being made in integrated circuit device and passive component technologies, advanced semiconductor packaging, including Wafer Level Packaging and breakthroughs in a host of other technological areas that enable the next level of functionality and functional integration. Miniaturization through Innovation!
Despite this recent reawakening and refocusing on wearable electronics, medical and consumer portable and wearable electronics of the past, though initially bulky and cumbersome have evolved over time and become increasingly ubiquitous in the 21st century, with the proliferation of smartphones, tablets, musical players, hearing aids, smart watches and the like. Through miniaturization and once unimaginable device functionality, countless revolutionary product applications are emerging with healthcare devices, smart glasses and smart watches likely to be the most dominant form factors.
This presentation will provide an overview of recent wearable electronic product advancements and the Wafer Level Packaging technologies that enabled them. Additionally, the state of the art and key new areas of technical innovation in WLP related packaging will be highlighted including reduced form factor, component thickness reduction, 3D packaging opportunities and interconnection schemes. Some of the assembly related constraints and enablers will be described and an overview of the WLCSP reliability requirements of various subclasses of wearable electronics provided.