Dr. Janusz Bryzek, Chair, TSensors Summit
Tuesday, November 11, 2014 | 8:00am - 9:00am, Oak Ballroom
We are witnessing the emergence of largest economic tide in history of humans, the Internet of Everything including eHealth. The magnitude of this global tide is estimated at $19 trillion by 2020, exceeding the size of today’s US economy.
The foundation for these global tides are sensors. Sensor use in mobile market grew to 10 billion units/year today, up from 10 million in 2007 (iPhone introduction). The Abundance (movement aiming at elimination of major global problems (such as hunger and lack of medical care) forecasts the demand for sensors to grow to 45 trillion in two decades. TSensors (Trillion Sensors) Initiative has emerged, aiming at acceleration of new sensor commercialization to support Abundance needs.
Sensors are starting to invade every aspect of our live, generating massive amounts of (Big) data. Consumer products already are using about 100 sensor types. Sensor derived data moving through the Cloud, Fog and Swarm networks is expected to reach a BrontoByte (1027) enabling Analytics on the unprecedented scale, and enabling prediction of our needs through Machine Learning algorithms running on quantum computers.
Sensors are one of the eight exponential technologies enabling growth of goods and services faster than growth of demand for them. Exponential technologies enable Exponential Organizations (ExO), which demonstrated sales growth to billion dollars in one to three years. New Exponential organizations are expected to replace 40% of Fortune 500 companies in coming decade, in a similar mode to Kodak replacement by Instagram in 2012.
This presentation will discuss these issues in more details and present an amazing showcase of available sensor based products.
Panel Discussion – Sponsored by
System Level Advantages of 3D Integration
Tuesday, November 11, 2014 | 1:15pm – 2:45pm, Oak Ballroom
For years the industry has discussed and debated 3D integration technologies, discussing the market drivers, technology challenges, supply chain issues, and above all, the cost. As the roadmaps continued to be pushed out, manufacturers, suppliers, and R&D centers have addressed these concerns, and foundries and OSATS have declared themselves ready to ramp production. But still, commercialization lags, waiting for system-level integrators to design in 3D ICs.
In this panel, system-level integrators and manufacturers will face-off in a discussion about the system-level advantages of 3D IC, whether 3D ICs can solve the issues of SoC design complexity and the cost of CMOS scaling to future nodes. The audience will participate in a real-time poll to gauge current industry understanding of these advantages, and the panelists will be invited to present their perspectives on the same polling questions.
Moderator: Francoise von Trapp, 3D InCites, Inc.
Rama Alapati, Global Foundries
Rozalia Beica, Yole Développement
Mike Gianfagna, eSilicon
Belgacem Haba, Google
Simon McElrea, Invensas
Robert Patti, Tezzaron Semiconductor Corp.
E. Jan Vardaman, TechSearch International Inc.
Rama Alapati is leading the Package Architecture and Customer Technology group focused on delivering package differentiated solutions. Rama led the 3D TSV technology startup in GLOBALFOUNDRIES Fab 8 for sub-20nm nodes. He was also responsible for Sub-20nm CPI qualification until recently. Rama represents GLOBALFOUNDRIES in consortia like imec, SRC and SEMATECH to drive packaging focused research programs. Prior to joining GLOBALFOUNDRIES, Rama was with Micron Technology for 8 years first as an etch engineer focused on pitch doubling technology for sub-50nm NAND and later on as a assignee at imec focusing on 3D-IC and BEoL integration. Rama graduated with Master of Science (Honors) in chemical engineering from the University of Kansas, Lawrence and prior to that received his Bachelor of Technology degree with distinction from Osmania University in Hyderabad, India.
Rozalia Beica is currently the CTO of Yole Developpement leading Advanced Packaging Business Unit and Semiconductor Manufacturing activities within Yole.
Rozalia is an international award (R&D 100) winning scientist with over 60 publications and several patents. For more than 16 years, Rozalia has been involved in the research, application and strategic marketing of Advanced Packaging and 3D IC technologies, with global leading responsibilities at materials (Rohm and Haas), equipment (Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations.
Rozalia is actively involved in industry activities and Advanced Packaging committees (General Chair elect - IMAPS DPC, Co-Chair ECTC AP Committee, General Chair GSF, member of ITRS, EMPC…)
Rozalia has a Global Executive MBA from IE Business School (Spain), M. Sc. In Management of Technology from KW University (USA) and a B.Sc/M.Sc in Chemical Engineering from Polytechnic University “Traian Vuia” (Romania).
Mike Gianfagna has over 30 years of business and technology experience in semiconductors and EDA. Prior to eSilicon, Mr. Gianfagna was vice president of corporate marketing at Atrenta, Inc., a privately held EDA company and CEO of Aprio Technologies, a venture-funded design-for-manufacturability startup. He has also held senior management positions at Cadence Design Systems, Zycad Corporation, General Electric and Harris Semiconductor (now Intersil). His career began at RCA Solid State, where he was part of the team that launched the company's ASIC business. He holds a BS/EE from New York University and an MS/EE from Rutgers University.
Dr. Belgacem Haba joined Google Data Center Platform as a senior staff in 2013. Prior he was Vice President and Senior Fellow at Tessera/Invensas since 1996. His latest activities while heading the Mobile R&D division includes developing 3D technologies for mobiles and servers. Dr. Haba also co-founded SiliconPipe Inc. in 2002, a high-speed interconnect start-up company based in Silicon Valley that got acquired by Samsung. Prior to that, he managed the advanced packaging R&D division at Rambus. And from 1991 to 1996, he worked for the NEC Central Research Laboratories in Tokyo Japan and, before that, for IBM Watson Research Center in New York. Dr. Haba Holds a Ph.D. in materials science and engineering in 1988 from Stanford University, California in the field of solar energy. He obtained also two master’s degrees in applied physics and materials science and both from Stanford University. And he received his bachelor's degree in physics from the University of Bab-Ezzouar, Algeria in 1980. Dr. Haba holds 270+ US issued patents, has authored numerous technical publications, and has also spoke at conferences worldwide.
Simon McElrea, President of Invensas Corporation, is an industry advocate promoting the need for supply chain collaboration as "advanced packaging" is increasingly displaced by interconnect technology. He has more than 15 years of executive, technical and operational management experience in semiconductor and green technology businesses, holding senior positions at Tessera, Honeywell Electronic Materials, Amkor Technology, Vertical Circuits and Johnson Matthey PLC. He has authored numerous patents in advanced electronics.
Robert Patti earned Bachelor of Science degrees in both physics and electrical engineering from Rose-Hulman Institute of laptops, handheld mobile communication systems, and aircraft telephone systems. Tezzaron Semiconductor grew from that company to become a leading force in 3D-IC technology. Its first working 3D-ICs emerged in 2004; today it creates cutting-edge memories and other semiconductor sub-components in both 3D and 2.5D. Bob received the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC's DDRIII / Future Memories Task Group, and holds 14 US patents, numerous foreign patents and many more pending patent applications in deep sub-micron semiconductor chip technologies.
E. Jan Vardaman founded TechSearch International Inc. in 1987, and since then has provided licensing and consulting services in semiconductor packaging. She is the co-author of How to Make IC Packages(published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly/Printed Circuit Board Fabrication, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a member of IEEE CPMT, SMTA, MEPTEC, IPC, IMAPS and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. She has made numerous presentations on developments in advanced packaging.
Tuesday, November 11, 2014 | 5:30pm – 7:00pm
Join us in the Bayshore Ballroom for the Exhibitor Reception on Tuesday Nov 11th (5:30pm - 7:30 p.m.) where the 50 + exhibitors will showcase the latest products and technologies offered by leading companies in the semiconductor packaging industry. The evening reception offers attendees numerous opportunities for networking and discussion with colleagues.
Plenary — Wearable, Wireless Health Solutions and Related Packaging Challenges
Mehran Mehregany, Ph.D., Case Western Reserve University
Wednesday, November 12, 2014 | 8:00am–9:00am, Oak Ballroom
Chronic diseases account for 75%+ of the US health care expenditures, i.e., $2 trillion. In the U.S., 141 million (45% of the population) have at least one chronic disease, 72 million of which have two or more. Top 10 significant chronic diseases are: hypertension, obesity, arthritis, asthma, chronic kidney disease, depression, chronic obstructive pulmonary disease (COPD), diabetes, sleep disorder and heart failure.
Use of sensor-enabled wearable wireless health solutions to monitor the health condition of chronic disease patients is key to the quality of life of the patient and to reduction of cost of health care—by keeping the patient out of the hospital and emergency rooms. Additionally, monitoring for early intervention is key to avoiding long-term adverse outcomes for those at risk of developing chronic diseases. This presentation will elaborate on the application opportunity and the important role that packaging plays in fielding successful wearable wireless health products.
Plenary - Wafer-Level Packaging Innovations to Enable Wearable Electronics
Theodore (Ted) G. Tessier, Flip Chip International, LLC
Wednesday, November 12, 2014 | 1:15pm – 2:15pm, Oak Ballroom
As has often been the case in the electronics industry, jargon like "Wearable Electronics" is quickly adopted to define revolutionary advances in novel functionality and form factors which in turn have enabled dramatic advancements in mankind’s quality of life and / or convenience. These advancements are made possible through the continual strides that are being made in integrated circuit device and passive component technologies, advanced semiconductor packaging, including Wafer Level Packaging and breakthroughs in a host of other technological areas that enable the next level of functionality and functional integration. Miniaturization through Innovation!
Despite this recent reawakening and refocusing on wearable electronics, medical and consumer portable and wearable electronics of the past, though initially bulky and cumbersome have evolved over time and become increasingly ubiquitous in the 21st century, with the proliferation of smartphones, tablets, musical players, hearing aids, smart watches and the like. Through miniaturization and once unimaginable device functionality, countless revolutionary product applications are emerging with healthcare devices, smart glasses and smart watches likely to be the most dominant form factors.
This presentation will provide an overview of recent wearable electronic product advancements and the Wafer Level Packaging technologies that enabled them. Additionally, the state of the art and key new areas of technical innovation in WLP related packaging will be highlighted including reduced form factor, component thickness reduction, 3D packaging opportunities and interconnection schemes. Some of the assembly related constraints and enablers will be described and an overview of the WLCSP reliability requirements of various subclasses of wearable electronics provided.