IWLPC
IWLPC - The Package for Success
October 11-14, 2010
Santa Clara Marriott Hotel
Santa Clara, CA
 

International Wafer-Level Packaging Conference

Wafer-Level, 3D, Stacked Packaging, and Chip Scale


Plans are underway for the 2010 program. Continue to check back here for developing information and contact Melissa Serres or Leslee Johns with any questions in the meantime.









Last update:    March 09, 2010





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