This information is for authors who were notified that their paper was selected for presentation at the International Wafer-Level Packaging Conference.
Congratulations Speakers! Your paper was selected by the Technical Committee and scheduled for presentation at IWLPC 2010 in Santa Clara, California. To help you prepare your technical paper and presentation, download the Speaker Manual, which includes IWLPC paper format requirements, event dates, conference contacts, a checklist of deadlines, examples of one and two column graphics or tables, and a sample paper to use as a visual reference.
Please complete and return the Contact Information Form to confirm your participation at IWLPC as a speaker, and also verify your correct mailing information for conference correspondence.
Hotel Reservations. We encourage you to make your reservations at the Marriott Hotel Santa Clara as soon as possible to assure that you have the accommodations that best suit your needs. Reservations are available NOW! NOTE: Discounted room rates expire on Friday, September 24!
Conference Registration.All speakers and panelists are required to register for the conference. Speakers and panelists are eligible for a reduced price. Click here to register now.
Use the links below to download required forms and for information that will make your participation as a speaker a successful experience. Please review the Speaker Manual to help you prepare your Technical Paper for the Proceedings CD Rom using IWLPC format requirements. The new 8.5 X 11 and A4 Title Page templates are available to help you lay out your final paper correctly.
ALL PAPERS ARE DUE AUGUST 13th!
PANELISTS
* Panelists who are writing papers will need to complete all of the forms included below (i.e. contact info form, copyright, bio, AV Special Request). Panelists NOT writing a paper may disregard the copyright form and paper requirements but should complete all other forms.
POSTER SESSION PRESENTERS
* Participants in the poster sessions should download the Poster Format Requirements and Speaker Manual.
Poster Format Requirements
Includes guidelines and requirements for poster presentations (not applicable for speakers & panelists).
Your paper was accepted and scheduled for presentation with the understanding that a written manuscript for the proceedings and a verbal presentation at the International Wafer-Level Packaging Conference are required. Papers (6-10 pages long including tables, graphs, and images) are due August 13th and should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Technical papers and presentation material must be original, unpublished, and non-commercial in nature.
After your technical paper is submitted:
Your presentation is due by Friday, September 24th. It is also recommended that you bring your presentation on a flash drive.
This information is for authors who were notified that their paper was selected for presentation at the International Wafer-Level Packaging Conference.
