Driving an Interconnected World
October 23 - 25, 2018
DoubleTree by Hilton San Jose
San Jose, California, USA

Speaker Information

This information is for authors who were notified that their paper was selected for presentation at the International Wafer-Level Packaging Conference.

Congratulations Speakers! Your paper was selected by the Technical Committee and scheduled for presentation at IWLPC 2018 in San Jose, California. To help you prepare your technical paper and presentation, download the Speaker Manual, which includes IWLPC paper format requirements, event dates, conference contacts, a checklist of deadlines, examples of one and two column graphics or tables, and a sample paper to use as a visual reference.

Please complete and return the Speaker Agreement Form to confirm your participation at IWLPC as a speaker, and also verify your correct mailing information for conference correspondence.

Hotel Reservations. We encourage you to make your reservations at the DoubleTree by Hilton San Jose as soon as possible to assure that you have the accommodations that best suit your needs. Reservations are available NOW! NOTE: Discounted room rates expire on September 28 or when hotel sells out.

Conference Registration. All speakers and panelists are required to register for the conference. Speakers and panelists are eligible for a reduced price.


Forms to complete and return:

  • Speaker Agreement Form - DUE IMMEDIATELY
  • Copyright Form - DUE IMMEDIATELY
  • Speaker Bio - DUE IMMEDIATELY

  • Due September 8th
    Speaker Manual

    Includes IWLPC paper format requirements, layout, and sample paper.
  • 8.5 x 11 Title Page template
  • A4 Title Page template
  • PowerPoint Format Template

  • Your paper was accepted and scheduled for presentation with the understanding that a written manuscript for the proceedings and a verbal presentation at the International Wafer-Level Packaging Conference are required. Papers (6-10 pages long including tables, graphs, and images) are due September 8th and should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Technical papers and presentation material must be original, unpublished, and non-commercial in nature.

    After your technical paper is submitted:
    Your presentation is due by September 8th. It is also recommended that you bring your presentation on a flash drive.

    If you have any questions or need assistance, please contact Jenny Ng, jenny@smta.org or 952-920-7682.

    Upload Your PPT Presentation Here
    Please note, larger file sizes require more time to upload. Press the "Done" button just once.

    First Name:

    Last Name:

    Upload Your Final Paper Here
    Please note, larger file sizes require more time to upload. Press the "Done" button just once.

    First Name:

    Last Name:

    Interactive Presentations (formerly Poster Sessions) Presenters
    * Participants in the Interactive Presentations should download the Poster Format Requirements and Speaker Manual.

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    Organized by: SMTA and ChipScale Review

    Supported by:
    MEPTEC Panel Level Packaging Consortium