October 13-16, 2008   Wyndham Hotel   San Jose, CA     The Conference    Special Events    Tech Sessions    Workshops    Sponsors Accommodations Become a Sponsor Register Now The IWLPC is supported by International Wafer-Level Packaging Conference Wafer-Level, 3D, Stacked Packaging, and Chip Scale Plans are underway for the 2008 program, with full conference information to be posted in April. Continue to check back here for developing information and contact Melissa Serres or Leslee Johns with any questions in the meantime. Last update:    August 08, 2008 Home | Top Copyright © 1999-2008 SMTA, All rights reserved. Reproduction in whole or in part without permission is prohibited. SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819