Event Registration

International Wafer-Level Packaging Conference

Wafer-Level, 3D, Stacked Packaging, MEMS, and Chip Scale


Plans are underway for the 2012 program. Continue to check back here for developing information and contact Patti Hvidhyld with any questions in the meantime.

Submit an abstract for 2012 today!

The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is April 27, 2012. Abstracts can be submitted quickly and easily from the Call for Papers page.

Order the 2011 Proceedings from the SMTA BookStore.
IWLPC 2011 Proceedings on USB Flash Drive
Non-Member Price: $160.00
Member Price: $150.00

The 8th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place October 3-6, 2011 at the Marriott Hotel in Santa Clara, CA.











Last update:    February 04, 2012





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