IWLPC - The Package for Success
Tutorials: November 5-6, 2012
Technical Conference: November 7-8, 2012
Exhibition: November 7-8, 2012
DoubleTree by Hilton Hotel | San Jose, CA
Wafer-Level, 3D, Stacked Packaging, MEMS, and Chip Scale
Plans are underway for the 2012 program. Continue to check back here for developing information and contact Patti Hvidhyld with any questions in the meantime.
The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is April 27, 2012. Abstracts can be submitted quickly and easily from the Call for Papers page.
The 8th annual IWLPC addressed cutting edge topics in 3 key technology tracks: Wafer-Level, 3D, and MEMS packaging. The proceedings contain over 30 technical papers from leading experts in the advanced packaging industry. The conference took place October 3-6, 2011 at the Marriott Hotel in Santa Clara, CA.
IWLPC - The Package for Success
