Driving an Interconnected World
October 23 - 25, 2018
DoubleTree by Hilton San Jose
San Jose, California, USA
Registration Hours
Mon, Oct 22
Tue, Oct 23
Wed, Oct 24
Thu, Oct 25

Panel Discussion

Wednesday, October 24

Tanja Braun Jan Vardaman

What is the Sweet Spot for Large Area (Panel) Packaging?

Tanja Braun, Fraunhofer IZM
E. Jan Vardaman, TechSearch International, Inc.

Fan-out Wafer Level Packaging has found widespread use in applications ranging from automotive and high-performance systems to mobile and consumer applications. A multitude of formats have been developed and moved into production. As with any package format, there is a quest for lower cost, and FO-WLP is no exception. Panel-level options are measured against wafer-level packaging and yield achievements. Until now the sweet spot for PLP is not really defined concerning target applications, integration density, panel size, lines and spaces, number of layers and yield. The topic on the sweet spot for PLP will be discussed with key players from industry.

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Organized by: SMTA and ChipScale Review

Supported by:
IEEE Electronic Packaging Society Panel Level Packaging Consortium

Supporting Media:
MEPTEC Open Sky Communications