Highlights of the 13th Annual IWLPC!
Bridging the Interconnect Gap
October 18 - 20, 2016 | San Jose, CA
A highly regarded annual technical conference that covers leading edge advancements in the area of Wafer-level technologies, the 2016 IWLPC conference was a great success with more 788 attendees. Three major themes were woven into the technical sessions: 1) Fan-out WLCSP, 2) 2.5 and 3D IC packaging, 3) MEMS packaging and a newly formed Manufacturing sub-track.
View the Technical Program for details.
Here are some of the conference and expo highlights:
Each year, IWLPC's venue in the heart of Silicon Valley also provides attendees with a great opportunity to network and meet with industry experts. We look forward to another successful conference next year and are actively looking for interested experts to participate in the technical committees. It is our key contributors who maintain the high technical quality of the presentations with which IWLPC has become synonymous.