SMTA and Chip Scale Review are pleased to announce the 10th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Keynote Speaker Announced
The Origins of Silicon Valley: Why and How It Happened Here
Paul Wesling, a CPMT Society Distinguished Lecturer, will give an exciting and colorful history of device technology development and innovation that began in San Francisco and Palo Alto, moved down the Peninsula (seeking lower costs and better housing), and ended up in the Santa Clara Valley during and following World War II. You'll meet some of the colorful characters -- Lee DeForest, Bill Eitel, Charles Litton, Fred Terman, David Packard, Bill Hewlett and others -- who came to define the worldwide electronics industries through their inventions and process development.
Congratulations to Michael Shillinger, Innovative Micro Technology on receiving Best of Conference for his presentation "MEMS Hermeticity & Reliability Testing Today"
Michael Shillinger, Founder, Innovative Micro Technology
Michael Shillinger has 25+ years of operations management experience, including high-volume wafer manufacturing. Previously Mr. Shillinger was the VP of Operations at Applied Magnetics Corporation, managing multiple wafer fabs and personnel for volume production of 6" wafers, operating 24 hours a day, 7 days a week. He has also held the position of VP of Process Engineering and Assembly Technology. Michael received his Masters in Mechanical Engineering from Case Western Reserve University in Cleveland Ohio.
The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submitting an abstract has been extended to April 19, 2013. Abstracts can be submitted quickly and easily from the Call for Papers page.
What You Are Saying About IWLPC
We have participated in the IWLPC for the last two years and have found that the technical presentations have been very enlightening. IMT being a MEMS foundry utilizes wafer level packaging in over 70% of the products that we produce and would not miss this important conference. We also found the exhibit hall experience very valuable.
-Michael Shillinger, Founder, Innovative Micro Technology (IMT)
The International Wafer Level Packaging Conference has consistently been an excellent venue for both its technical presentations and vendor exhibits. We have been attending the IWLPC for the last seven years and found it to be very valuable for both our people and company. -Robert Marshall, RMM
IWLPC is the premier conference for emerging packaging technologies from the chip scale to the wafer scale. The conference brings together vendors, users and decision makers and is extremely valuable to EV Group.
-Garrett Oakes, Technology Director, EV Group
IWLPC brings visitors from around the world to a focused event that allows exchange of new developments and ideas.
-E. Jan Vardaman, President, TechSearch International, Inc.
International Wafer-Level Packaging Conference
