Why Exhibit at IWLPC?
* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
What's Included?
NEW to 2013! Full Pipe and Draped Booths, 8’x10’ and 8’x8’ Sizes Available (See Floor Plan)
Lunch and Coffee Breaks Each day
Exhibitor Cocktail Reception
One Keynote Dinner Ticket
Attendee List
Show Directory Listing
Company Sign
IWLPC Proceedings Flash Drive
One Conference Pass (a $650 value)
Can I Sponsor?
Numerous levels are available. Find more info here.
Questions? Contact Kim Newman at 408-429-8585 or knewman@chipscalereview.com.
What type of attendees will you network with at IWLPC?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
A Successful Last Year
Thank you to everyone that participated in IWLPC 2012. Attendance reached an all-time high. The conference and exhibition was a resounding success and we look forward to seeing everyone in 2013!
International Wafer-Level Packaging Conference
