Exhibitor Info

November 7-8, 2012
DoubleTree by Hilton Hotel, Santa Clara, CA

View the floor plan

Registered Exhibitor Details

Exhibitors
* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads

Included in the cost to exhibit:
  • 10 feet in width and 6 feet in depth pipe and drape booth
  • Lunch and coffee breaks each day
  • Exhibitor reception
  • One keynote dinner ticket
  • Attendee List
  • Show directory listing
  • Company Sign
  • IWLPC proceedings on CD Rom
  • One Conference pass (a $650 value)

  • Cost: $1,250 per booth plus $50 extra for electric in booth.

    Please contact your Chip Scale Review sales representative or Seana Wall from SMTA with questions or for more information.


    Sponsorship Opportunities
    View available Sponsorship Opportunities

    Show Directory Advertising Opportunities

    Become an IWLPC Sponsor/Advertiser Today!


    What type of attendees will you network with at IWLPC?
    Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

    A Successful Last Year
    Thank you to everyone that participated in IWLPC 2011. Attendance reached an all-time high. The conference and exhibition was a resounding success and we look forward to seeing everyone in 2012!


    2011 Exhibitor List:
    Advanced Component Labs
    AEHR Test Systems
    AGC
    AI Technology, Inc.
    Amkor Technology, Inc.
    Applied Chemical Laboratories
    Boschman Technologies
    Chip Scale Review
    CPS Technologies
    Electra Polymers Ltd
    Engent
    EV Group, Inc.
    GPD Global
    Hesse & Knipps, Inc.
    Indiana Integrated Circuits, LLC
    Interconnect Devices, Inc.
    Kyzen Corporation
    Lambda Technologies, Inc.
    Mirror Semiconductor, Inc.
    NAMICS
    NANIUM S.A.
    New Venture Research Corporation
    Newport Corporation
    NEXX Systems
    Owens Design
    Pac Tech USA
    Promex Industries, Inc.
    Quik-Pak / Gel-Pak
    Rofin-Baasel, Inc.
    S-Cubed
    Sensata Technologies
    SET - Smart Equipment Technology
    Silex Microsystems
    Solid State Equipment L.L.C.
    STATS ChipPAC Ltd.
    Strasbaugh
    Suss MicroTec, Inc.
    Tamarack Scientific Co., Inc.
    TechSearch International Inc.
    Teramikros Inc. (ex-Casio Micronics Co., Ltd.)
    Tessera
    Unisem Inc.
    Yield Engineering Systems, Inc.
    Yole Développement






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