Sponsored jointly by the SMTA and Chip Scale Review magazine, The seventh annual IWLPC will explore cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
2009 IWLPC attendance reached an all-time high! Attendees came from over 15 countries around the world including Argentina, Belgium, Canada, Finland, France, Germany, Ireland, Israel, Japan, Morocco, Netherlands, Republic of Korea, Sweden, Taiwan and the United Kingdom.
October 13-14, 2010
Marriott Hotel
Santa Clara, CA
10/13: 10:00am - 6:30pm
10/14: 10:00am - 1:00pm
One tabletop space in the center of the room is $995, and one along the wall, allowing for pop-up or other tall displays, is $1195. Register early - exhibit space is limited and will sell out!EXHIBITOR REGISTRATION
Exhibitors can Register Online Now or download a hard-copy registration form.
EXHIBITOR DETAILS
The price to exhibit includes a draped table and two chairs, basic electrical outlet, lunch each day, one conference pass, one Keynote Dinner ticket, an electronic attendee list, show directory listing, company sign, and the 2009 IWLPC Proceedings on CD.
PLEASE NOTE: Pop-up displays can only be placed around the perimeter of the room and a limited number of these spaces are available on a first-come first-served basis. The additional exhibit spaces in the center of the room can hold literature, signs, easels etc.
Past (2009) IWLPC Exhibitors
Action Integrated Resources
Advance Reproductions Corp.
AEHR Test Systems
AGC
AI Technology, Inc.
Alchimer
Artwork Conversion Software
Automation & Robotics Research Institute
BEST Inc.
Boschman Technology B.V.
Chip Scale Review
Diemat, Inc.
DPE Integration
E-Tec Interconnect
Electronic Trend Publications
EV Group
FlipChip International LLC
Fralock NOWE Materials Division
FRT of America, LLC
Infinite Graphics Inc.
Ironwood Electronics
Kanematsu USA Inc.
Kyzen Corporation
Liberty Research Co.
Lintec of America, Inc.
Matech
Mühlbauer Inc.
Multitest
NEXX Systems, Inc. Gold Sponsor
Owens Design
Pac Tech USA Gold Sponsor
Photo Stencil
Promex Industries Inc.
Quik-Pak
Sekisui Products
Silex Microsystems
SMTA
Solid State Equipment Corporation
Spheretek LLC Div of MVM Technologies Inc.
STM
Tango Systems, Inc.
TechSearch International, Inc.
Tessera, Inc.
The Dow Chemical Company Gold Sponsor
Transition Automation, Inc.
Viscom
