Advanced Packaging in the New Connected World
October 22 - 24, 2019
DoubleTree by Hilton San Jose
San Jose, California, USA

Sponsorship and Exhibitor Information


Dates: October 22-23, 2019
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 21
Move in: 12:00pm-5:00pm

Tuesday, October 22
10:00am-5:00pm
5:00pm-6:00pm (Networking Reception)

Wednesday, October 23
10:00am-5:00pm
Move out: 5:00pm-7:00pm

Click here to review Sponsorships and Exhibits
IWLPC Expo Prospectus

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
$1500 $1700
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 

Click here for the latest floorplan


Current Exhibitor List:

ACCRETECH America, Inc.  #3
AEMtec GmbH  #52
AI Technology, Inc.  #11
Akrometrix LLC  #44
Axus Technology  #18
Cadence Design Systems, Inc.  #22
Camtek USA Inc  #15
Canon USA  #57
Condair, Inc.  #26
Cyber technologies USA, LLC  #25
EV Group  #36
Finetech  #23
Fraunhofer IIS/EAS  #5
Fraunhofer IZM  #41
FRT of America  #2
Heidelberg Instruments, Inc.  #40
Hitachi High-Tech Analytical Science  #48
IMAT, Inc.  #27
Integra Technologies, LLC  #54
JCET  #35
LB Semicon  #62
Lintec of America, Inc.  #38
Mentor, A Siemens Business  #32
Neutronix - Quintel  #21
Nikon Metrology  #10
Nordson SONOSCAN  #56
PacTech USA  #28
Plan Optik AG  #55
Plasma-Therm, LLC  #24
Practical Components  #31
PURE TECHNOLOGIES  #19
Quartet Mechanics  #43
Rudolph Technologies  #30
SHENMAO America, Inc.  #12
Simco-Ion Technology Group  #49
STARS MICROELECTRONICS  #59
Stäubli Electrical Connectors, Inc.  #29
SÜSS MicroTec, Inc.  #13
SVXR  #55
Taiyo Ink  #14
TechSearch International  #20
Teikoku Taping System Inc  #53
Toray International America Inc.  #33
Unisem  #37
Xperi  #34
Yield Engineering Systems, Inc.  #39
Yole Développement & System Plus Consulting  #17
Zuken, Inc.  #61

Questions?

Please contact Kim Newman from Chip Scale Review or Hannah Terhark from SMTA with questions or for more information.





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Organized by: SMTA and ChipScale Review



Supported by:
IEEE Electronic Packaging Society

Supporting Media:
MEPTEC Open Sky Communications