Driving an Interconnected World
October 23 - 25, 2018
DoubleTree by Hilton San Jose
San Jose, California, USA
Registration Hours
Mon, Oct 22
3:00pm-7:00pm
Tue, Oct 23
7:00am-5:30pm
Wed, Oct 24
7:30am-5:30pm
Thu, Oct 25
7:30am-5:30pm

Sponsorship and Exhibitor Information


Dates: October 23-24, 2018
Location: DoubleTree by Hilton Hotel, San Jose, CA

Monday, October 22
Move in: 12:00pm-5:00pm

Tuesday, October 23
10:00am-4:30pm
4:30pm-6:00pm (Networking Reception)

Wednesday, October 24
10:00am-4:00pm
Move out: 4:00pm-7:00pm

 

Click here to view the floor plan!


IWLPC Expo Prospectus

View the exhibitor prospectus and application for 2018!

 

How Much is it to Exhibit?

  Early Registration
Before/On July 30th
Regular Registration
After July 30th
One Booth
(8' D x 10' W)
SOLD OUT! SOLD OUT!
One Table
(6' Table)
$1100 $1300


Why Exhibit at IWLPC?

* Reach a focused international audience
* Generate Exposure in this highly competitive marketplace
* Share New Products and concepts to the market
* Enhance Relationships with existing customers and generate new leads
 

What type of attendees will be there?

Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!
 


Current Exhibitor List:

Able Print Technology Co., Ltd.  #62
Accretech America, Inc.  #33
AEHR Test Systems  #51
AEMtec GmbH  #52
AI Technology  #17
Ajinomoto Fine-Techno USA Corporation  #49
Akrometrix, LLC  #42
Amkor Technology  #35
Artwork Conversion Software Inc./Mango  #56
ASM AMICRA Microtechnologies GmbH  #22
Axus Technology  #10
BESI North America  #53
Bruker  #63
Cadence Design Systems, Inc.  #3
Camtek USA Inc  #15
Canon USA  #55
Chip Scale Review
cyberTECHNOLOGIES USA, LLC  #1
EMD Performance Materials Corp.  #8
EMS  #23
ERS Electronic GmbH  #60
EV Group  #36
Evatec AG  #50
Finetech/Martin  #16
Fraunhofer IZM - Institute for Reliability and Microintegration  #41
FRT of America  #5
Henkel Electronic Materials  #44
Hitachi Chemical Co. Ltd.  #48
IMAT, Inc.  #2
Indium Corporation  #46
ITW EAE  #64
KYEC USA  #28
LB Semicon  #76
Lintec of America, Inc.  #43
Mentor, A Siemens Business  #39
Muhlbauer, Inc.  #61
Nanotronics  #27
nepes US Inc.  #70
Nikon Metrology, Inc.  #6
NXQ Neutronix Quintel  #21
OAI Lithography  #26
Pac Tech USA  #25
Plasma-Therm, LLC  #38
Practical Components  #29
PURE TECHNOLOGIES  #19
Quartet Mechanics  #18
SETNA  #11
SHENMAO Technology Inc.  #12
Smiths Interconnect  #14
Sonoscan, Inc.  #54
SPTS Technologies  #24
STARS Microelectronics USA  #57
STATS ChipPAC Ltd.  #4
Superior Silica, LLC  #30
SUSS MicroTec Inc.  #13
System Plus Consulting  #45
Taiyo Ink  #32
Tango Systems, Inc.  #65
Teradyne Inc.  #31
Toray International America Inc.  #40
TRUMPF, Inc.  #20
Unisem  #37
Xperi  #34
Yield Engineering Systems, Inc.  #7
YINCAE Advanced Materials, LLC  #47
YXLON  #58
Zuken, Inc.  #59

Questions?

Please contact Chip Scale Review or Jenny Ng from SMTA with questions or for more information.





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Organized by: SMTA and ChipScale Review



Supported by:
IEEE Electronic Packaging Society Panel Level Packaging Consortium

Supporting Media:
MEPTEC Open Sky Communications