IWLPC
IWLPC - The Package for Success
October 11-14, 2010
Santa Clara Marriott Hotel
Santa Clara, CA
 

International Wafer-Level Packaging Conference Call for Papers

International Wafer-Level Packaging Conference
The SMTA and Chip Scale Review magazine are pleased to announce plans for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC). This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is April 23, 2010.

The conference includes three tracks with two days of papers covering: Wafer Level Packaging; 3-D (Stacked) Packaging; and MEMS Packaging.

Wafer Level Packaging:
  • Wafer Level Chip Scale Packaging (WLCSP),
  • Flip Chip Bumping
  • Fan-Out and Redistribution
  • Markets and Trends
  • Metrology and Testing
  • Wafer and Device Cleaning
  • WL-Enabled Devices
  • Nanotechnology
  • Quality, Reliability, and COO

    MEMS Packaging:
  • MEMS Processes and Materials
  • MEMS Design Tools or Methods
  • Nano-MEMS and Bio-MEMS
  • MOEMS Integration
  • Lab-on-Chip
  • 3-D Integration:
  • 3D WLP
  • Thru Silicon Vias (TSV)
  • Silicon Interposers
  • Wafer Thinning and Handling
  • Stacking Processes (W2W,D2W,D2D)
  • IC Packaging Substrate
  • SIP/SOP vs. SOC
  • Mixed Chip Integration Issues
  • Embedded Die and Passives
  • Modeling & Simulation Tools and Methods
  • TSV Integration: FEOL vs BEOL
  • Metrology and Testing
  • Reliability and Inspection


  • We would be pleased to have you submit an abstract for this program. 200-300 word abstracts should be submitted on-line or by email to Melissa Serres melissa@smta.org. Please include a title, author name, and contact information with your abstract. Authors will be notified of acceptance in May 2010. Note that technical papers are required and will be due in August 2010.

    ABSTRACT SUBMISSION DEADLINE IS APRIL 23, 2010.

    Upload abstracts by clicking on the tab below.





    Home | Top


    Copyright © 1999-2010 SMTA, All rights reserved.
    Reproduction in whole or in part without permission is prohibited.
    SMTA Headquarters - 5200 Willson Road - Suite 215 - Edina - MN - 55424 - Phone 952.920.7682 - Fax 952.926.1819