Call for Papers
International Wafer-Level Packaging Conference
The SMTA and Chip Scale Review are pleased to announce plans for the 14th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
The IWLPC Technical Committee would like to invite you to submit an abstract for this program.
The conference includes three tracks with two days of technical paper presentations covering: Wafer-Level Packaging; 3D (Stacked) Packaging; and MEMS Packaging. Also we will offer professional development courses.
Wafer Level Chip Scale Packaging (WLCSP), Flip-chip, Fan-Out and Redistribution, Wafer and Device Cleaning, Nanotechnology, Quality, Reliability, and COO.
3D Package Integration:
3D WLP, Thru Silicon Vias (TSV), Thru Glass Vias (TGV), Silicon Interposers, Stacking Processes (W2W, D2W, D2D), IC Packaging Substrates, TSV Integration methods (FEOL vs BEOL.)
Advanced Integrated Systems and Devices:
System packaging leveraging wafer-level process technologies including: System-in-Package (SiP), MEMS, sensors, Package-on-Package (PoP), embedded die and passives, and EMI shielding methods.
Advances in wafer-level manufacturing processes, equipment and materials including: novel process or material technologies, improved equipment throughput and productivity, control methodologies (SPC, APC, FDC), factory output & cycle time improvements, advanced automation technologies, warped wafer handling, wafer level test methods, wafer level vs. singulated unit test for WLP, and TSV test methods.
If you would like to present at this conference, please submit a 200-300 word abstract. Please include a title, author name, and contact information with your abstract.
Note that technical papers are required and will be due September 8th, 2017.
For more information on the conference, exhibition, or sponsorship opportunities, please contact Jenny Ng at email@example.com or 952-920-7682.