International Wafer-Level Packaging Conference
The SMTA and Chip Scale Review are pleased to announce plans for the 9th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submittal is April 27, 2012.
The conference includes three tracks with two days of technical paper presentations covering: Wafer Level Packaging; 3-D (Stacked) Packaging; and MEMS Packaging. Also we will offer professional development courses.
Wafer Level Packaging:
Wafer Level Chip Scale Packaging (WLCSP)
Flip Chip Bumping
Fan-Out and Redistribution
Wafer and Device Cleaning
WL-Enabled Devices
Nanotechnology
Quality, Reliability, and COO
MEMS Packaging:
MEMS Processes and Materials
MEMS Design Tools or Methods
Nano-MEMS and Bio-MEMS
MOEMS Integration
Lab-on-Chip
MEMS Integration and Interconnects
RF/wireless, sensors, mixed technology, optoelectronics
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3-D Package Integration:
3D WLP
Thru Silicon Vias (TSV)
Silicon Interposers
Stacking Processes (W2W, D2W, D2D)
IC Packaging Substrate
Embedded Die and Passives
Modeling & Simulation Tools and Methods
TSV Integration: FEOL vs BEOL
Chip to Chip Optical Connection
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If you would like to present at this conference, please submit a 200-300 word abstract by April 27th, 2012 to iwlpc.com. Please include a title, author name, and contact information with your abstract.
Note that technical papers are required and will be due August 30th, 2012.
For more information on the conference, please contact Patti Hvidhyld at 952-920-7682 or to patti@smta.org. For information to exhibit and sponsorship opportunities please contact Seana Wall at 952-920-7682 or to seana@smta.org
ABSTRACT SUBMISSION DEADLINE IS April 27, 2012.
Upload abstracts by clicking on the tab below.
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