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Become a Sponsor

Last Year


2013 Sponsors:

Platinum Sponsors:

Deca Technologies

Invensas

STATSChipPac

SUSS MicroTec



Gold Sponsors:
ACM
EV Group

Nanium

Pac Tech USA



Silver Sponsor:

Applied Materials



Flashdrive Sponsor:

Indium Corporation



Refreshment Sponsor:

EV Group



Supported by:






Call for Papers

International Wafer-Level Packaging Conference


The SMTA and Chip Scale Review are pleased to announce plans for the 10th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being applied to Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Abstract deadline has been extended to April 19, 2013.


The conference includes three tracks with two days of technical paper presentations covering: Wafer Level Packaging; 3-D (Stacked) Packaging; and MEMS Packaging. Also we will offer professional development courses.

Wafer Level Packaging:
  • Wafer Level Chip Scale Packaging (WLCSP)
  • Flip Chip Bumping
  • Fan-Out and Redistribution
  • Wafer and Device Cleaning
  • WL-Enabled Devices
  • Nanotechnology
  • Quality, Reliability, and COO

    MEMS Packaging:
  • MEMS Processes and Materials
  • MEMS Design Tools or Methods
  • Nano-MEMS and Bio-MEMS
  • MOEMS Integration
  • Lab-on-Chip
  • MEMS Integration and Interconnects
  • RF/wireless, sensors, mixed technology, optoelectronics
  • 3-D Package Integration:
  • 3D WLP
  • Thru Silicon Vias (TSV)
  • Silicon Interposers
  • Stacking Processes (W2W, D2W, D2D)
  • IC Packaging Substrate
  • Embedded Die and Passives
  • Modeling & Simulation Tools and Methods
  • TSV Integration: FEOL vs BEOL
  • Chip to Chip Optical Connection


  • If you would like to present at this conference, please submit a 200-300 word abstract by March 29th, 2013. Please include a title, author name, and contact information with your abstract.
    Note that technical papers are required and will be due August 23, 2013.

    For more information on the conference, please contact Patti Hvidhyld at 952-920-7682 or to patti@smta.org. For information to exhibit and sponsorship opportunities please contact Seana Wall at 952-920-7682 or to seana@smta.org






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