IWLPC:
Connecting the Future of WLP, 3D, MEMS
October 11-14, 2010
Santa Clara Marriott Hotel
Santa Clara, CA
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The IWLPC is
supported by
International Wafer-Level Packaging Conference
Wafer-Level, 3D, Stacked Packaging, and Chip Scale
Plans are underway for the 2010 program.
Continue to check back here for developing information and contact Melissa Serres or Leslee Johns with any questions in the meantime.
Last update: March 13, 2010
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