Silicon to Systems
October 24 - 26, 2017
DoubleTree by Hilton San Jose
San Jose, California, USA

Panel Discussions



Tuesday, October 18


Jan Vardaman The Role for Large-Area Panel Processing in the Quest for Low-Cost FOWLP
Moderator: Jan Vardaman, TechSearch International, Inc.

Panelists:
  • Bernard Adams, STATS ChipPAC Inc.
  • David Butler, SPTS Technologies
  • Choon Lee, Lam Research
  • Urmi Ray, Qualcomm Technologies, Inc.


  • Wednesday, October 19th


    Urmi Ray Chip-Package Interaction (CPI) Challenges and Solutions for WLP and FOWLP
    Moderator: Urmi Ray, Qualcomm

    Panelists:
  • Rama Alapati, Amkor Technologies
  • John Hunt, ASE
  • Paul Mescher, Microsoft
  • Jan Vardaman, TechSearch International, Inc.
  • Luu Nguyen, Texas Instruments




  • Home | Top

    Organized by: SMTA and ChipScale Review



    Supported by:
    MEMS Journal MEPTEC MCA Public Relations