NEW! Interactive Presentations (Posters)
Tuesday, October 1810:00am-1:30pm
Stop by and learn current research, case histories and projects from authors through Interactive Presentations. Interact with authors directly on topics on 3D, Manufacturing Challenges, MEMS and WLP.
Presentation will include:Bridging the Gap: A Cohesive Design to Sign-off Platform for Wafer-Level Packaging
John Ferguson, Mentor Graphics
Performance Limits of Stacked FO WLPs and their Mitigation
Dev Gupta, APSTL
High-Performance, Low-Cost Photoresist Strip for Advanced Packaging Applications
George Chiaverini, Veeco Precision Surface Processing, and Amy Lujan, SavanSys Solutions LLC
Novel WLCSP Technology Solution for Fusion Device of CMOS Integrated Circuit with MEMS
Takahide Murayama, ULVAC, Inc.
Laminatable Positive-Tone Photosensitive Polyimide
Masao Tomikawa, Ph.D., Toray Industries, Inc.
Board Level Reliability of Automotive eWLB (Embedded Wafer-Level BGA)
Seung Wook Yoon, STATS ChipPAC Pte Ltd.
Study on a Formulated Flux for Ultra-Fine Flip Chip Interconnect
Hsiang Chuang Chen, SHENMAO America, Inc.