Interconnecting WLP, MEMS & 3D Integration
October 13 - 15, 2015
DoubleTree San Jose Airport Hotel
San Jose, CA

IWLPC - Interconnecting WLP, MEMS & 3D Integration

SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

2014 Best Papers Announced

Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner.

Boyd Rogers, Deca Technologies

Best Paper and WLP Track:
Enhancing WLCSP Reliability Through Build-Up Structure Improvements and New Solder Alloys

Boyd Rogers, Deca Technologies
Co-authors: M. Melgo, M. Almonte, S. Jayaraman, C. Scanlan, and T. Olson

Sumant Sood, KLA-Tencor

Best of Conference Presentation:
High Throughput Wafer Edge Inspection and Monitoring for Advanced Wafer Level Packaging

Sumant Sood, KLA-Tencor
Co-Authors: Rohit Bhat, Heiko Eisenbach, Marc Filzen, Prashant Aji, Youxian Wen (KLA Tencor); Thomas Uhrmann, Julian Bravin, and Jürgen Burggraf (EV Group)

Guilian Gao, Invensas Corporation

3D Track:
Addressing Critical Assembly Challenges In 2.5D and 3D IC Assembly

Guilian Gao, Invensas Corporation
Co-authors: Scott McGrath, Bong-Sub Lee, Cyprian Uzoh, Grant Villavicencio, Hala Shaba, Liang Frank Wang, Sitaram Arkalgud, Eric Tosaya

Cihan Yilmaz, Northeastern University

MEMS Track:
A New Manufacturing Approach For Fabricating Next Generation 3-D Interconnects For MEMS and ICs Using Directed Nanoparticle Assembly

Cihan Yilmaz, Northeastern University
Co-authors: Adnan Korkmaz, Steven Varni, and Ahmed Busnaina (Northeastern University); Dongguang Wei (Carl Zeiss)

What You Are Saying About IWLPC

We have participated in the IWLPC for the last two years and have found that the technical presentations have been very enlightening. IMT being a MEMS foundry utilizes wafer level packaging in over 70% of the products that we produce and would not miss this important conference. We also found the exhibit hall experience very valuable.
-Michael Shillinger, Founder, Innovative Micro Technology (IMT)
The International Wafer Level Packaging Conference has consistently been an excellent venue for both its technical presentations and vendor exhibits. We have been attending the IWLPC for the last seven years and found it to be very valuable for both our people and company.
-Robert Marshall, RMM
IWLPC is the premier conference for emerging packaging technologies from the chip scale to the wafer scale. The conference brings together vendors, users and decision makers and is extremely valuable to EV Group.
-Garrett Oakes, Technology Director, EV Group
IWLPC brings visitors from around the world to a focused event that allows exchange of new developments and ideas.
-E. Jan Vardaman, President, TechSearch International, Inc.

Home | Top

Organized by SMTA and ChipScale Review