The Conference
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Last Year


Platinum Sponsors:

Applied Materials


Deca Technologies

Invensas

SUSS MicroTec



Gold Sponsors:
EV Group

Nanium

Pac Tech USA



Silver Sponsor:

LB Semicon



Supported by:


MEMS Journal

MEPTEC

Roger Grace Associates

Yole Developpment

International Wafer-Level Packaging Conference

SMTA and Chip Scale Review are pleased to announce the 11th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.


Submit an abstract for 2014!

The IWLPC Technical Committee would like to invite you to submit an abstract for this program. Deadline for submitting an abstract has been extended to April 18, 2014. Abstracts can be submitted quickly and easily from the Call for Papers page.


2013 Best Papers Announced

Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best of Conference winner.

Jessica Fredlund, Silex Microsystems AB

Best of Conference and 3D Track:
Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors

Jessica Fredlund, R&D Project Manager, Silex Microsystems AB
Co-authors: Toby Ebefors, Silex Microsystems AB; Erik Jung and Tanja Braun, Ph.D., from Fraunhofer IZM

MEMS Track:
Advanced Metal-Eutectic Bonding for high volume MEMS WLP

Sumant Sood, SUSS MicroTec
Co-authors: Robert Hergert, SUSS MicroTec and Oliver Treichel, SUSS MicroTec Lithography

WLP Track:
Implementation of a Fully Molded Fan-Out Packaging Technology

William Rogers, Ph.D., DECA Technologies
Co-authors: Chris Scanlan and Tim Olson, DECA Technologies


What You Are Saying About IWLPC

We have participated in the IWLPC for the last two years and have found that the technical presentations have been very enlightening. IMT being a MEMS foundry utilizes wafer level packaging in over 70% of the products that we produce and would not miss this important conference. We also found the exhibit hall experience very valuable.
-Michael Shillinger, Founder, Innovative Micro Technology (IMT)
The International Wafer Level Packaging Conference has consistently been an excellent venue for both its technical presentations and vendor exhibits. We have been attending the IWLPC for the last seven years and found it to be very valuable for both our people and company.
-Robert Marshall, RMM
IWLPC is the premier conference for emerging packaging technologies from the chip scale to the wafer scale. The conference brings together vendors, users and decision makers and is extremely valuable to EV Group.
-Garrett Oakes, Technology Director, EV Group
IWLPC brings visitors from around the world to a focused event that allows exchange of new developments and ideas.
-E. Jan Vardaman, President, TechSearch International, Inc.


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