IWLPC - Interconnecting WLP, MEMS & 3D Integration
SMTA and Chip Scale Review are pleased to announce the 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
2014 Best Papers AnnouncedWinners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner.
Best Paper and WLP Track:
Enhancing WLCSP Reliability Through Build-Up Structure Improvements and New Solder Alloys
Boyd Rogers, Deca Technologies
Co-authors: M. Melgo, M. Almonte, S. Jayaraman, C. Scanlan, and T. Olson
Best of Conference Presentation:
High Throughput Wafer Edge Inspection and Monitoring for Advanced Wafer Level Packaging
Sumant Sood, KLA-Tencor
Co-Authors: Rohit Bhat, Heiko Eisenbach, Marc Filzen, Prashant Aji, Youxian Wen (KLA Tencor); Thomas Uhrmann, Julian Bravin, and Jürgen Burggraf (EV Group)
Addressing Critical Assembly Challenges In 2.5D and 3D IC Assembly
Guilian Gao, Invensas Corporation
Co-authors: Scott McGrath, Bong-Sub Lee, Cyprian Uzoh, Grant Villavicencio, Hala Shaba, Liang Frank Wang, Sitaram Arkalgud, Eric Tosaya
A New Manufacturing Approach For Fabricating Next Generation 3-D Interconnects For MEMS and ICs Using Directed Nanoparticle Assembly
Cihan Yilmaz, Northeastern University
Co-authors: Adnan Korkmaz, Steven Varni, and Ahmed Busnaina (Northeastern University); Dongguang Wei (Carl Zeiss)
What You Are Saying About IWLPC
-Michael Shillinger, Founder, Innovative Micro Technology (IMT)
-Robert Marshall, RMM
-Garrett Oakes, Technology Director, EV Group
-E. Jan Vardaman, President, TechSearch International, Inc.